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PDF HSMD-T525 Data sheet ( Hoja de datos )
| Número de pieza | HSMD-T525 | |
| Descripción | Surface Mount High Performance AlInGaP LED Indicators | |
| Fabricantes | Agilent(Hewlett-Packard) | |
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Surface Mount High
Performance AlInGaP LED
Indicators
Technical Data
H
SunPower Series
HSMA-TX25
HSMD-TX25
HSMJ-TX25
Features
• Outstanding LED Material
Efficiency
• Exceptional Light Output
Over a Wide Range of Drive
Currents
• Colors: 590 nm Amber, 603
nm Orange, and 615 nm
Reddish-Orange
• Compatible with Automatic
Placement Equipment
• Compatible with Convective
IR, Vapor Phase Reflow, and
TTW Solder Processes
• Packaged in 12 mm or 8 mm
Tape on 7" or 13" Diameter
Reels
• EIA Standard Package
• Low Package Profile
• Non-diffused Package
Excellent for Backlighting
and Coupling to Light Pipes
Description
The LED material used in these
devices is the very efficient
absorbing Substrate aluminum
indium gallium phosphide (AS
AlInGaP), capable of producing
high light output over a wide
range of drive currents.
These solid state surface mount
indicators are designed with a flat
top and sides to be easily handled
by automatic placement equip-
ment. A glue pad is provided for
adhesive mounting processes.
They are compatible with
convective IR and vapor phase
reflow soldering, through the
wave (TTW) soldering, and
conductive epoxy attachment
processes.
The package size and configura-
tion conform to the EIA-535
BAAC standard specification for
case size 3528 tantalum
capacitors. The folded leads
permit dense placement and
provide an external solder joint
for ease of inspection.
These devices are non-diffused,
providing high intensity for
applications such as backlighting,
light pipe illumination, and front
panel indication.
Device Selection Guide
Amber
λd = 590 nm
HSMA-T425
Orange
λd = 603 nm
HSMD-T425
HSMA-T525
HSMD-T525
HSMA-T625
HSMD-T625
HSMA-T725
HSMD-T725
Reddish-Orange
λd = 615 nm
HSMJ-T425
HSMJ-T525
HSMJ-T625
HSMJ-T725
Description
12 mm Tape, 7" Reel, 2000 Devices
12 mm Tape, 13" Reel, 8000 Devices
8 mm Tape, 7" Reel, 2000 Devices
8 mm Tape, 13" Reel, 8000 Devices
5964-9352E
1-199
1 page  
Recommended Printed Circuit Board Attachment Pad Geometries
INFRARED/VAPOR PHASE
REFLOW SOLDERING
4.45
(0.175)
COMPONENT LOCATION
ON PAD
2.41
(0.095)
1.65
(0.065)
CONDUCTIVE ATTACHMENT
4.45
(0.175)
2.41
(0.095)
1.65
(0.065)
0.64 (0.025) SQ.
CENTERED HOLE
COMPONENT LOCATION
ON PAD
NOTE: ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Convective IR Reflow
Soldering
For information on convective IR
reflow soldering, refer to the
Supplement to Application Note
1060, Surface Mounting SMT
LED Components.
1-203
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet HSMD-T525.PDF ] | |
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