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HS-26C31RH の電気的特性と機能

HS-26C31RHのメーカーはIntersil Corporationです、この部品の機能は「Radiation Hardened Quad Differential Line Driver」です。


製品の詳細 ( Datasheet PDF )

部品番号 HS-26C31RH
部品説明 Radiation Hardened Quad Differential Line Driver
メーカ Intersil Corporation
ロゴ Intersil Corporation ロゴ 




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HS-26C31RH Datasheet, HS-26C31RH PDF,ピン配置, 機能
DATASHEET
Radiation Hardened Quad Differential Line Driver
HS-26C31RH, HS-26C31EH
The Intersil HS-26C31RH, HS-26C31EH are quad differential
line drivers designed for digital data transmission over
balanced lines and meets the requirements of EIA standard
RS-422. Radiation hardened CMOS processing assures low
power consumption, high speed, and reliable operation in the
most severe radiation environments.
The HS-26C31RH, HS-26C31EH accept CMOS levels and converts
them to RS-422 compatible outputs. These circuits uses special
outputs that enable the drivers to power-down without loading
down the bus. Enable and disable pins allow several devices to be
connected to the same data source and addressed
independently.
Specifications for Rad Hard QML devices are controlled by the
Defense Logistics Agency Land and Maritime (DLA). The SMD
numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96663. A “hot-link” is provided on our
homepage for downloading.
Features
• Electrically screened to SMD #5962-96663
• QML qualified per MIL-PRF-38535 requirements
• 1.2 Micron radiation hardened CMOS
- Total dose up to . . . . . . . . . . . . . . . . . . . . . . . . 300kRAD(Si)
• Latchup free
• EIA RS-422 compatible outputs (except for IOS)
• CMOS inputs
• High impedance outputs when disabled or powered down
• Low power dissipation . . . . . . . . . . . . 2.75mW standby (max)
• Single 5V supply
• Low output impedance . . . . . . . . . . . . . . . . . . . . . .10or less
• Full -55°C to +125°C military temperature range
Applications
• Line transmitter for MIL-STD-1553 serial data bus
Ordering Information
ORDERING NUMBER
(Note 1)
INTERNAL
MKT. NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
5962F9666301QEC
HS1-26C31RH-8
Q 5962F96 6630QEC
-55 to +125 16 LD SBDIP
D16.3
5962F9666301QXC
HS9-26C31RH-8
Q 5962F96 66301QXC
-55 to +125 16 LD FLATPACK
K16.A
5962F9666301VEC
HS1-26C31RH-Q
Q 5962F96 66301VEC
-55 to +125 16 LD SBDIP
D16.3
5962F9666301VXC
HS9-26C31RH-Q
Q 5962F96 66301VXC
-55 to +125 16 LD FLATPACK
K16.A
HS1-26C31RH/PROTO
HS1-26C31RH/PROTO
HS1- 26C31RH/PROTO
-55 to +125 16 LD SBDIP
D16.3
HS0-26C31RH/SAMPLE HS0-26C31RH/SAMPLE
-55 to +125 Die
HS9-26C31RH/PROTO
HS9-26C31RH/PROTO
HS9- 26C31RH/PROTO
-55 to +125 16 LD FLATPACK
K16.A
5962F9666301V9A
HS0-26C31RH-Q
-55 to +125 Die
5962F9666303VEC
HS1-26C31EH-Q
Q 5962F96 66303VEC
-55 to +125 16 LD SBDIP
D16.3
5962F9666303VXC
HS9-26C31EH-Q
Q 5962F96 66303VXC
-55 to +125 16 LD FLATPACK
5962F9666303V9A
HS0-26C31EH-Q
-55 to +125 Die
5962F9666301VYC
HS9G-26C31RH-Q (Note 2)
Q 5962F96 66301VYC
-55 to +125 16 LD FLATPACK
K16.A
HS9G-26C31RH/PROTO HS9G-26C31RH/PROTO (Note 2) HS9G-26C31RH/PROTO
-55 to +125 16 LD FLATPACK
K16.A
NOTES:
1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations.
2. The lid of these packages are connected to the ground pin of the device.
May 23, 2013
FN3401.7
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2011, 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.

1 Page





HS-26C31RH pdf, ピン配列
HS-26C31RH, HS-26C31EH
Die Characteristics
DIE DIMENSIONS:
96.5 mils x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 10kÅ ±1kÅ
Metallization:
M1: Mo/TiW
Thickness: 5800Å
M2: Al/Si/Cu (Top)
Thickness: 10kÅ ±1kÅ
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0x105A/cm2
Bond Pad Size:
110µmx100µm
Metallization Mask Layout
HS-26C31RH, HS-26C31EH
AO (2)
AO (3)
ENABLE (4)
BO (5)
BO (6)
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
3 FN3401.7
May 23, 2013


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共有リンク

Link :


部品番号部品説明メーカ
HS-26C31RH

Radiation Hardened Quad Differential Line Driver

Intersil Corporation
Intersil Corporation
HS-26C31RH-T

Radiation Hardened Quad Differential Line Driver

Intersil
Intersil


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