PDF HUL7001 Data sheet ( Hoja de datos )

Número de pieza	HUL7001
Descripción	Hologram Unit
Fabricantes	Panasonic Semiconductor
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No Preview Available ! Hologram Unit HUL7001 Hologram Unit For optical information processing Features Smaller package size achieved through micro-mirror integration (4.8 × 8.2 × 4.3 mm) Focus error signal detection : SSD method Tracking error signal detection : 3-beam method Low-power semiconductor laser included 1 2 3 4 5 6 (0.2) (0.5) Index mark for No.1 pin on reverse side 11.2±0.2 8.2±0.2 ø8.0 +0 –0.05 O Y Reference plane 12 11 10 9 X 8 7 Reference plane Apparent emitting point Apparent emitting point Reference plane Unit : mm 4.33±0.2 2.55±0.2 SEC. X-O-Y Applications CD Absolute Maximum Ratings (Ta = 25˚C) Parameter Laser beam output Laser reverse voltage Monitor PD reverse voltage Signal processing PD reverse voltage Operating ambient temperature Storage temperature Symbol PO VR(LD) VR(mon) VR Topr Tstg Ratings 0.3 2 12 12 – 10 to +60 – 40 to +85 8.1±0.2 SEC. X-O-Y (Note): 1.Standard corner R=0.20 max. 2.Thickness of plate:Ni 1µm min.+Au 0.1µm min. 3.Thickness of hologram=2.0mm, n=1.519 Unit mW V V V ˚C ˚C Unit Characteristic Specifications (Tc = 25 ± 3˚C) Parameter Symbol Conditions min typ max Unit Threshold current Operating current Operating voltage Laser beam output Focus error signal amplitude Tracking error signal amplitude Focus error signal defocusing Tracking error signal symmetry Focus error signal pull-in range Ith1 IOP1,2 VOP1,2 PO1,2 IFE1,3 ITE1,4 DFO1,5 BTE1,4 DFE1,3 CW CW IRF = 10µA, VR = 5V CW IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V IRF = 10µA, VR = 5V 20 30 40 mA 25 35 45 mA 1.9 2.4 V 0.15 0.22 mW 7 10 13 µA 0.8 1.3 1.8 µA –8 +8 % – 30 + 30 % 12 µm 1 Measurements are made using the reference optical system during measurement and the radiant power measurement system on the hologram unit shown in Fig. 2. 2 It should be noted that the RF signal amplitude in these specifications is denoted by IRF, and represents the amplitude of the 11T signal. As in the case described in 1, IRF is measured using the measurement system shown in Fig. 2. 3 The definition is illustrated in Fig. 3. 4 The definition is illustrated in Fig. 4. *5 The definition is illustrated in Fig. 5. 1 1 page Hologram Unit HUL7001 4. Important Information Regarding Soldering Special plastics are used in the LDHU package and hologram. Therefore only the leads (pins) should be heated (during soldering iron, dip, etc.), and soldering time should be short. Total heating methods such as reflow soldering should be avoided. (This device is gold-plated to ensure good solder adhesion, so a short soldering time is sufficient.) It is also recommended that a heat sink or other means be used to improve the package’s heat-releasing effects in order to pre- vent the package from becoming hot as a result of heat transfer and radiation even when the leads are heated. Soldering location A A A : Make sure there is a gap of at least 1mm. Soldering temperature and time Temperature : 260˚C maximum Time : 5 seconds maximum 5. Flux cleaning method Alcohol is recommended as a solvent for flux clean- ing. Chlorine base solvents in particular are a cause of lead corrosion and device deterioration. Petroleum base solvents should be avoided since they deteriorate the adhesive between the holo- gram and package. In addition, ultrasonic cleaning should be avoided since the device is hollow. Care should be taken in brushing the hologram surface, as this may scratch the back side. 6. Mechanical stress (1) Pressure on the package The LDHU package is made thin in order to re- duce its size. Therefore, pressure on the package resulting of heat release, etc. may cause problems such as a change in the package shape or changes to its characteristics. In the point pressure appli- cation, force should be limited to 1kgf (9.8N) or less, but please design so that the area pressure application can be adopted as much as possible. (2) Lead formation and cutting In cases where lead formation and cutting are re- quired, these actions must be performed at nor- mal temperatures prior to soldering. Machining steps performed at high temperatures immediately after soldering, or after the solder has hardened should be avoided. In addition, steps should be taken to ensure that excessive mechanical stress is not applied during lead formation and cutting. Special care should be taken to avoid stress on the lead bases of the package, as this may create problems such as chipping the resin. 7. Other issues (1) The surface of the hologram is very important for light emission and light detecting. Therefore care should be taken to ensure that there are no finger- prints on the surface, residual flux after solder- ing, or adhering dust. (2) Viewing the laser beam with the naked eye is ex- tremely dangerous and may result in blindness. Do not look directly at the laser while it is operat- ing. (3) The products listed in this document are intended for use in standard applications, i.e., general elec- tronic devices (such as office equipment, measur- ing equipment, and consumer electronics prod- ucts). Customers considering applications involv- ing special quality and reliability requirements and carrying a risk of loss of human life or bodily dam- age in the event of an accident or malfunction, or specific applications (such as aerospace applica- tions, transportation equipment, combustion equipment, and safety devices), and customers considering applications other than the standard applications intended by us should contact our sales office before using these products. 5 5 Page

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