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NFP0NCN901HL3D の電気的特性と機能

NFP0NCN901HL3DのメーカーはmuRataです、この部品の機能は「Common Mode Noise Filter」です。


製品の詳細 ( Datasheet PDF )

部品番号 NFP0NCN901HL3D
部品説明 Common Mode Noise Filter
メーカ muRata
ロゴ muRata ロゴ 




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NFP0NCN901HL3D Datasheet, NFP0NCN901HL3D PDF,ピン配置, 機能
Reference Only
Spec No. JEFL243E-0025-01
Common Mode Noise Filter
NFP0NCN☐☐☐HL3
P1/9
Reference Specification
1. Scope
This reference specification applies to Chip Common Mode Noise Filter NFP0NCN Series.
2. Part Numbering
(ex.) NF P 0N C N 162
(1) (2) (3) (4) (5) (6)
(1) Chip Common Mode Noise Filter
(2) Structure (P : Film Type)
(3) Dimension (L×W) 0N : 0.85×0.65mm
(4) Type
(5) Category N : General Use
3. Rating
HL3D
(7) (8) (9) (10)
(6) Common Mode Insertion Loss Characteristic
Resonant Frequency(Typ.)
(7) Circuit H : Characteristic Impedance 100Ω system
(8) Features
(9) Number of Line
(10) Packaging Code D : Taping / B : Bulk
Customer
Part Number
MURATA
Part Number
Common Mode
Impedance
(Ωtyp.)
at 100MHz
Common Mode
Insertion Loss Characteristic
(dB Typ.)
@700MHz @900MHz @1.7GHz @2.4GHz
NFP0NCN901HL3D
65
28 33 23 18
NFP0NCN901HL3B
65
28 33 23 18
NFP0NCN162HL3D
30
17 20 28 22
NFP0NCN162HL3B
30
17 20 28 22
MURATA
Part Number
Rated
Current
(mA)
Rated
Voltage
(V(DC))
Withstanding
Voltage
(V(DC))
DC
Resistance
(Rdc)
()
Insulation
Resistance
(I.R.)
(Mmin.)
Cut off
Frequency
(GHz Typ.)
NFP0NCN901HL3D
100
5
12.5
3.0±30%
100
NFP0NCN901HL3B
100
5
12.5
3.0±30%
100
NFP0NCN162HL3D
100
5
12.5
2.3±30%
100
NFP0NCN162HL3B
100
5
12.5
2.3±30%
100
Operating Temperature : -40 to +85°C Storage Temperature : -40 to +85°C
4.5
4.5
7.0
7.0
4. Standard Testing Conditions
<Unless otherwise specified>
Temperature : Ordinary Temperature 15 to 35°C
Humidity : Ordinary Humidity 25 to 85%(RH)
5.Style and Dimensions
(Top View)
<In case of doubt>
Temperature : 20 ± 2°C
Humidity : 60 to 70%(RH)
Atmospheric Pressure : 86 to106kPa
Equivalent Circuits
(5) (3) (1)
(Side View)
(Bottom View)
6.Marking
No Marking.
(5) (3) (1)
(6) (4) (2)
(6) (4) (2)
No polarity.
Unit Mass(Typical value)
0.0008g
MURATA MFG.CO., LTD

1 Page





NFP0NCN901HL3D pdf, ピン配列
Reference Only
Spec No. JEFL243E-0025-01
P3/9
No. Item
9.3 Heat life
Specification
Meet Table 1.
9.4 Cold Resistance
Test Method
Temperature : 85±2°C
Test Voltage : 2 times for Rated Voltage
Time : 1000 h (+48 h,-0 h)
Then measured after exposure in the room condition
for 4 to 48 h.
(ref. Item 10.)
Temperature : -40± 2°C
Time : 1000 h (+48 h,-0 h)
Then measured after exposure in the room condition
for 4 to 48 h.
10. Terminal to be Tested.
When measuring and suppling the voltage,the following terminal is applied.
No. Item
10.1 Common Mode Impedance
(Measurement Terminal)
Terminal
Terminal to be Tested
Terminal
10.2 Withstanding Voltage (Measurement Terminal)
Insulation Resistance (Measurement Terminal)
Heat Life (Supply Terminal)
10.3 DC Resistance (Measurement Terminal)
Terminal
(- )
Terminal
Terminal
(+)
Terminal
Terminal
Terminal
Terminal
Terminal
11. Measuring method for common mode impedance.
Measured common mode impedance may be included measurement error due to stray capacitance, residual
inductance of test fixture.
To correct this error, the common mode impedance should be calculate as follows;
(1) Measure admittance of the fixture(opened), Go Bo.
(2) Measure impedance of the fixture(shorted), Rs Xs.
(3) Measure admittance of the specimen, Gm Bm.
(4) Calculate corrected impedance Zusing the formula below.
Z= (Rx2+Xx2) 1/2
Where
Rx =
Gm - Go
(Gm-Go)+ (Bm-Bo)
Rs
Xx =
- (Bm - Bo)
(Gm-Go)+ (Bm-Bo)
Xs
12. P.C.B., Flux, Solder and Soldering condition
Test shall be done using P.C.B., Flux, Solder and Soldering condition which are specified in item 16 except the
case of being specified special condition.
MURATA MFG.CO., LTD


3Pages


NFP0NCN901HL3D 電子部品, 半導体
Reference Only
Spec No. JEFL243E-0025-01
P6/9
16. Notice
This product is designed for solder mounting. (reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
16.1 Flux and Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
16.2 Assembling
<Thermal Shock>
Pre-heating should be in such a way that the temperature difference between solder and ceramic surface is
limited to 100°C MAX. Also cooling into solvent after soldering should be in such a way that the temperature
difference is limited to 100°C max.
16.3 Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In
prior to use, please make the reliability evaluation with the product mounted in your application set.
16.4 Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
a Products shall be location the sideways
b Direction (Length : a<b) to the machanical
Stress.
Poor example
Warping direction
a
b
Warping direction 1
Good example
a
b
Warping direction 2
Products(warping direction 1, warping direction
2) shall be located carefully so that products are
not subject to the mechanical stress due to
warping the board. Because they may be
subjected the mechanical stress in order of
warping direction 1>warping direction 2.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part.
A>B
(3) Keep the mounting position of the component away from the board separation surface. A > C
Perforation B
A Slit
C
D
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB,
therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
During the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Screw
Hole
Recommended
MURATA MFG.CO., LTD

6 Page



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部品番号部品説明メーカ
NFP0NCN901HL3B

Common Mode Noise Filter

muRata
muRata
NFP0NCN901HL3D

Common Mode Noise Filter

muRata
muRata


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