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SP1011-04UTG の電気的特性と機能

SP1011-04UTGのメーカーはLittelfuseです、この部品の機能は「TVS Diode Arrays」です。


製品の詳細 ( Datasheet PDF )

部品番号 SP1011-04UTG
部品説明 TVS Diode Arrays
メーカ Littelfuse
ロゴ Littelfuse ロゴ 




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SP1011-04UTG Datasheet, SP1011-04UTG PDF,ピン配置, 機能
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1011 Series
SP1011 Series 7pF 15kV Unidirectional TVS Array
RoHS Pb GREEN
Description
Zener diodes fabricated in a proprietary silicon avalanche
technology protect each I/O pin to provide a high level of
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above
the maximum level specified in the IEC 61000-4-2
international standard (Level 4, ±8kV contact discharge)
without performance degradation. Their very low loading
capacitance also makes them ideal for protection high-
speed signal pins.
Pinout
I/O (1)
I/O (4)
GND
GND
I/O (2)
I/O (3)
µDFN-6
(1.25x1.0x0.5mm)
Functional Block Diagram
65
4
1 23
Additional Information
Datasheet
Resources
Samples
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
Features
• RoHS compliant and
lead-free
• ESD, IEC 61000-4-2,
±15kV contact, ±30kV air
• Lightning, IEC 61000-
4-5, 2nd Edition, 2A
(tp=8/20µs)
• Low capacitance of 7 pF
(TYP) per I/O @ 2.5V
• L ow leakage current of
1µA (MAX) at 5V
• Tiny μDFN( JEDEC MO-
229) package (1.25mm x
1.0mm x 0.5mm)
• E FT protection
IEC 61000-4-4, 40A
(5/50ns)
Applications
• LCD/PDP TV
• DVD Player
• Desktop
• Set Top Box
• Mobile Phone
• Notebook
• MP3/PMP
• Digital camera
Application Example
Input
Keyboard
Controller
D1
D2
D3
D4
SP1011-04UTG
Shield
Ground
Signal
Ground
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17

1 Page





SP1011-04UTG pdf, ピン配列
TVS Diode Arrays (SPA® Diodes)
General Purpose ESD Protection - SP1011 Series
Soldering Parameters
Reflow Condition
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (Liquidus) Temp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
-Temperature (TL) (Liquidus)
- Temperature (tL)
PeakTemperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peakTemperature (TP)
Do not exceed
Pb – Free assembly
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
Package Dimensions — µDFN-6 (1.25x1.0x0.5mm)
Top View
D
6 54
123
Pin 1 Index Area
A
E
B
Bottom View
4 56
L
0.05 C
0.05 C
Pin 1 chamfer
0.10 x 45’
3 21
Side View
0.05 C
A
A1 A3
Seating plane
bC
0.10 M C A B
0.05 M C
Recommanded Soldering Pad for µDFN-6L 1.25 x1.0x0.5 mm
1.1
0.4
TP
TL
TS(max)
TS(min)
25
Ramp-up
Preheat
tS
time to peak temperature
tP
Critical Zone
TL to TP
tL
Ramp-down
Time
Package
JEDEC
Symbol
A
A1
A3
b
D
D2
E
E2
e
L
µDFN-6 (1.25x1.0x0.5mm)
MO-229
Millimeters
Inches
Min Max Min Max
0.45
0.55
0.018
0.022
0.00
0.05
0.000
0.002
0.127 REF
0.005 REF
0.15
0.25
0.006
0.010
1.20
1.30
0.047
0.051
----
0.95
1.05
0.037
0.041
----
0.4 REF
0.016 REF
0.25
0.35
0.010
0.014
0.1 0.3
Total:+/- 0.01mm
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17


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部品番号部品説明メーカ
SP1011-04UTG

TVS Diode Arrays

Littelfuse
Littelfuse


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