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1N6338D PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 1N6338D
部品説明 500mW GLASS ZENER DIODES
メーカ Microsemi
ロゴ Microsemi ロゴ 



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1N6338D Datasheet, 1N6338D PDF,ピン配置, 機能
1N6309 thru 1N6355D
Available on
commercial
versions
VOIDLESS HERMETICALLY SEALED
500mW GLASS ZENER DIODES
Qualified per MIL-PRF-19500/533
DESCRIPTION
This Zener voltage regulator series is military qualified and is ideal for high-reliability
applications where a failure cannot be tolerated. These industry-recognized 0.5 watt Zener
voltage regulators are hermetically sealed with voidless-glass construction using an internal
metallurgical bond. It includes Zener selections from 2.4 to 200 volts in standard 5%
tolerances as well as 1% and 2% tolerances. They are also available in surface-mount
packages. Microsemi also offers numerous other Zener products to meet higher and lower
power ratings in both thru-hole and surface mount packages.
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
JEDEC registered 1N6309 thru 1N6355 series.
Voltage tolerances of 1%, 2% and 5% are available. (See part nomenclature.)
Voidless hermetically sealed glass package.
Internal “Category 1metallurgical bonds for 1N6321 thru 1N6355 and “Category IIIfor 1N6309
thru 1N6320.
JAN, JANTX, JANTXV, and JANS reliability levels are available per MIL-PRF-19500/533.
RoHS compliant versions available (commercial grade only).
APPLICATIONS / BENEFITS
Small DO-35 size package (or “D” Package).
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 2.4 to 200 volts.
Standard and tight voltage tolerances available.
Extremely robust construction.
Flexible axial-lead mounting terminals.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Inherently radiation hard as described in Microsemi “MicroNote 050”.
Qualified Levels:
JAN, JANTX, JANTXV
and JANS
DO-35 or
“D” Package
Also available in:
“B” SQ MELF package
(surface mount)
1N6309US – 1N6355DUS
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead (1)
1N6309 – 1N6320
1N6321 – 1N6355
Thermal Resistance Junction-to-Ambient (2)
Steady-State Power Dissipation @ TL = 75 oC
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
TJ and TSTG
R ӨJL
R ӨJA
PD
VF
T SP
Value
-65 to +175
150
95.5
240
0.5
1.4
260
Unit
oC
oC/W
oC/W
W
V
oC
Notes:
1. At 3/8 inch (10 mm) from body. See Figure 1 and Figure 2 for derating.
2. TA = +55 °C before derating on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-
Oz Cu, horizontal, still air, pads = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch
(25.4 mm) long, axial lead length L ≤ .187 inch (≤ 4.75 mm); RΘJA with a defined thermal resistance
condition included is measured at IZ = as defined in the characteristics and ratings table herein.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0193, Rev. 2 (111899)
©2011 Microsemi Corporation
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