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PDF MDC3105LT1 Data sheet ( Hoja de datos )
| Número de pieza | MDC3105LT1 | |
| Descripción | Inductive Load Driver | |
| Fabricantes | ON Semiconductor | |
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MDC3105LT1
Integrated Relay,
Inductive Load Driver
This device is intended to replace an array of three to six discrete
components with an integrated SMT part. It is available in a SOT−23
package. It can be used to switch 3 to 6 Vdc inductive loads such as
relays, solenoids, incandescent lamps, and small DC motors without
the need of a free−wheeling diode.
• Provides a Robust Driver Interface between D.C. Relay Coil and
Sensitive Logic Circuits
• Optimized to Switch Relays from a 3 V to 5 V Rail
• Capable of Driving Relay Coils Rated up to 2.5 W at 5 V
• Features Low Input Drive Current & Good Back−to−Front Transient
Isolation
• Internal Zener Eliminates Need for Free−Wheeling Diode
• Internal Zener Clamp Routes Induced Current to Ground for Quieter
System Operation
• Guaranteed Off State with No Input Connection
• Supports Large Systems with Minimal Off−State Leakage
• ESD Resistant in Accordance with the 2000 V Human Body Model
• Low Sat Voltage Reduces System Current Drain by Allowing Use of
Higher Resistance Relay Coils
Applications Include:
• Telecom: Line Cards, Modems, Answering Machines, FAX
Machines, Feature Phone Electronic Hook Switch
• Computer & Office: Photocopiers, Printers, Desktop Computers
• Consumer: TVs & VCRs, Stereo Receivers, CD Players, Cassette
Recorders, TV Set Top Boxes
• Industrial: Small Appliances, White Goods, Security Systems,
Automated Test Equipment, Garage Door Openers
• Automotive: 5.0 V Driven Relays, Motor Controls, Power Latches,
Lamp Drivers
http://onsemi.com
RELAY/INDUCTIVE
LOAD DRIVER
SILICON SMALLBLOCK]
INTEGRATED CIRCUIT
3
1
2
SOT−23
(TO−236)
CASE 318
STYLE 6
MARKING
DIAGRAM
JW D
JW = Specific Device Code
D = Date Code
INTERNAL CIRCUIT DIAGRAM
Vout (3)
Vin 1.0 k
(1) 33 k
6.6 V
GND (2)
ORDERING INFORMATION
Device
MDC3105LT1
Package
SOT−23
Shipping†
3000 Units/Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
March, 2004 − Rev. 3
1
Publication Order Number:
MDC3105LT1/D
1 page  
MDC3105LT1
10,000 k
1000 k
VCC = 5.5 Vdc
100 k
10 k
1.0 k
100
10
TYPICAL PERFORMANCE CHARACTERISTICS
(OFF CHARACTERISTICS)
Vin = 0.5 Vdc
100 k
10 k
TJ = 25°C
Vin = 0.5 Vdc
Vin = 0.35 Vdc
1.0 k
100
Vin = 0.35 Vdc
Vin = 0 Vdc
10
1.0
Vin = 0 Vdc
1.0
−55
−35 −15
5.0 25
45
TJ, JUNCTION TEMPERATURE (°C)
65
Figure 8. Output Leakage Current versus
Temperature
85
1.0
0
0 1.0 2.0 3.0 4.0 5.0 6.0 7.0
VCC, SUPPLY VOLTAGE (Vdc)
Figure 9. Output Leakage Current versus
Supply Voltage
RCE(sat)
TA = 25°C
° = TRANSISTOR PC THERMAL LIMIT
* = MAX L/R FROM ZENER PULSED ENERGY LIMIT
(REFER TO FIGURE 11)
0.1
Iout(max) = 500 mA
°PW = 10 ms
DC = 20%
°PW = 7.0 ms
DC = 5%
*24 ms
*34 ms
°CONTINUOUS DUTY
°PW = 0.1 s
DC = 50%
*90 ms
*232 ms
*375 ms
0.01
0.1
1.0
Vout (VOLTS)
Figure 10. Safe Operating Area
VCC(max) = +6.0 Vdc
TYPICAL
IZ vs VZ
10
http://onsemi.com
5
5 Page 
MDC3105LT1
PACKAGE DIMENSIONS
A
L
3
BS
12
VG
C
DH
SOT−23 (TO−236)
CASE 318−08
ISSUE AH
KJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318−03 AND −07 OBSOLETE, NEW STANDARD
318−08.
INCHES
DIM MIN MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0350 0.0440
D 0.0150 0.0200
G 0.0701 0.0807
H 0.0005 0.0040
J 0.0034 0.0070
K 0.0140 0.0285
L 0.0350 0.0401
S 0.0830 0.1039
V 0.0177 0.0236
MILLIMETERS
MIN MAX
2.80 3.04
1.20 1.40
0.89 1.11
0.37 0.50
1.78 2.04
0.013 0.100
0.085 0.177
0.35 0.69
0.89 1.02
2.10 2.64
0.45 0.60
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MDC3105LT1.PDF ] | |
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