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i.MX23のメーカーはFreescale Semiconductorです、この部品の機能は「Applications Processor」です。 |
部品番号 | i.MX23 |
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部品説明 | Applications Processor | ||
メーカ | Freescale Semiconductor | ||
ロゴ | |||
このページの下部にプレビューとi.MX23ダウンロード(pdfファイル)リンクがあります。 Total 30 pages
i.MX23 Applications Processor
Reference Manual
IMX23RM
Rev. 1
11/2009
Preliminary—Subject to Change Without Notice
1 Page Paragraph
Number
Contents
Title
Co nt en ts
Page
Number
Chapter 1
Product Overview
1.1
1.2
1.2.1
1.2.2
1.2.2.1
1.2.2.2
1.2.2.3
1.2.3
1.2.4
1.2.5
1.2.6
1.2.7
1.2.8
1.2.9
1.2.10
1.2.11
1.2.12
1.2.12.1
1.2.12.2
1.2.13
1.2.14
1.2.15
1.2.16
1.2.17
1.2.18
1.2.19
1.2.19.1
1.2.19.2
1.2.19.3
1.2.19.4
1.2.20
1.2.21
1.2.22
1.2.23
1.2.24
1.2.25
Hardware Features ........................................................................................................... 1-2
i.MX23 Product Features ................................................................................................. 1-5
ARM 926 Processor Core ............................................................................................ 1-7
System Buses ............................................................................................................... 1-7
AXI Bus ................................................................................................................... 1-9
AHB Bus.................................................................................................................. 1-9
APB Buses ............................................................................................................... 1-9
On-Chip RAM and ROM .......................................................................................... 1-10
External Memory Interface........................................................................................ 1-10
On-Chip One-Time-Programmable (OCOTP) ROM ................................................ 1-12
Interrupt Collector...................................................................................................... 1-12
DMA Controller......................................................................................................... 1-12
Clock Generation Subsystem..................................................................................... 1-13
Power Management Unit ........................................................................................... 1-13
USB Interface ............................................................................................................ 1-14
General-Purpose Media Interface (GPMI) ................................................................ 1-15
Hardware Acceleration for ECC for Robust External Storage .................................. 1-15
Reed-Solomon ECC Engine .................................................................................. 1-16
Bose Ray-Choudhury Hocquenghem ECC Engine ............................................... 1-16
Data Co-Processor (DCP)—Memory Copy, Crypto,
and Color-Space Converter.................................................................................... 1-17
Mixed Signal Audio Subsystem ................................................................................ 1-17
Master Digital Control Unit (DIGCTL)..................................................................... 1-19
Synchronous Serial Port (SSP) .................................................................................. 1-19
I2C Interface............................................................................................................... 1-19
General-Purpose Input/Output (GPIO)...................................................................... 1-19
Display Processing..................................................................................................... 1-19
Display Controller / LCD Interface (LCDIF)........................................................ 1-20
Pixel Processing Pipeline (PXP)............................................................................ 1-21
PAL/NTSC TV-Encoder ........................................................................................ 1-21
Video DAC ............................................................................................................ 1-22
SPDIF Transmitter ..................................................................................................... 1-22
Dual Serial Audio Interfaces...................................................................................... 1-22
Timers and Rotary Decoder ....................................................................................... 1-22
UARTs ....................................................................................................................... 1-22
Low-Resolution ADC, Touch-Screen Interface, and Temperature Sensor................ 1-23
Pulse Width Modulator (PWM) Controller ............................................................... 1-23
Freescale Semiconductor
i.MX23 Applications Processor Reference Manual, Rev. 1
Preliminary—Subject to Change Without Notice
i
3Pages Paragraph
Number
Contents
Title
Chapter 8
USB High-Speed Host/Device Controller
Page
Number
8.1
8.2
8.3
8.4
8.4.1
8.5
8.5.1
8.6
Overview.......................................................................................................................... 8-1
USB Programmed I/O (PIO) Target Interface ................................................................. 8-3
USB DMA Interface ........................................................................................................ 8-3
USB UTM Interface......................................................................................................... 8-3
Digital/Analog Loopback Test Mode .......................................................................... 8-3
USB Controller Flowcharts ............................................................................................. 8-4
References.................................................................................................................... 8-7
Programmable Registers .................................................................................................. 8-7
9.1
9.2
9.2.1
9.2.2
9.2.3
9.2.4
9.2.4.1
9.2.4.2
9.2.4.3
9.2.4.4
9.2.4.5
9.2.4.6
9.2.4.7
9.2.4.8
9.2.5
9.2.5.1
9.2.5.2
9.2.5.3
9.2.5.4
9.2.5.5
9.2.6
9.3
9.4
Chapter 9
Integrated USB 2.0 PHY
Overview.......................................................................................................................... 9-1
Operation ......................................................................................................................... 9-2
UTMI ........................................................................................................................... 9-2
Digital Transmitter....................................................................................................... 9-2
Digital Receiver ........................................................................................................... 9-2
Analog Receiver .......................................................................................................... 9-2
HS Differential Receiver ......................................................................................... 9-3
Squelch Detector...................................................................................................... 9-3
FS Differential Receiver .......................................................................................... 9-4
HS Disconnect Detector .......................................................................................... 9-4
USB Plugged-In Detector ........................................................................................ 9-4
Single-Ended USB_DP Receiver ............................................................................ 9-4
Single-Ended USB_DN Receiver............................................................................ 9-4
9X Oversample Module........................................................................................... 9-4
Analog Transmitter ...................................................................................................... 9-4
Switchable High-Speed 45Ω Termination Resistors................................................ 9-5
Full-Speed Differential Driver................................................................................. 9-5
High-Speed Differential Driver ............................................................................... 9-5
Switchable 1.5KΩ USB_DP Pullup Resistor........................................................... 9-5
Switchable 15KΩ USB_DP Pulldown Resistor ....................................................... 9-5
Recommended Register Configuration for USB Certification .................................... 9-7
Behavior During Reset..................................................................................................... 9-8
Programmable Registers .................................................................................................. 9-8
i.MX23 Applications Processor Reference Manual, Rev. 1
iv Freescale Semiconductor
Preliminary—Subject to Change Without Notice
6 Page | |||
ページ | 合計 : 30 ページ | ||
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データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。 |
部品番号 | 部品説明 | メーカ |
i.MX23 | Applications Processor | Freescale Semiconductor |