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UPD78F0410 の電気的特性と機能

UPD78F0410のメーカーはNECです、この部品の機能は「8-Bit Single-Chip Microcontrollers」です。


製品の詳細 ( Datasheet PDF )

部品番号 UPD78F0410
部品説明 8-Bit Single-Chip Microcontrollers
メーカ NEC
ロゴ NEC ロゴ 




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UPD78F0410 Datasheet, UPD78F0410 PDF,ピン配置, 機能
User’s Manual
78K0/LC3
8-Bit Single-Chip Microcontrollers
μPD78F0400
μPD78F0401
μPD78F0402
μPD78F0403
μPD78F0410
μPD78F0411
μPD78F0412
μPD78F0413
The 78K0/LC3 has an on-chip debug function.
Do not use this product for mass production because its reliability cannot be guaranteed after the on-chip debug function
has been used, due to issues with respect to the number of times the flash memory can be rewritten. NEC Electronics
does not accept complaints concerning this product.
Document No. U18698EJ1V0UD00 (1st edition)
Date Published June 2007 NS
Printed in Japan
2007

1 Page





UPD78F0410 pdf, ピン配列
NOTES FOR CMOS DEVICES
1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2 HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3 PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred. Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded. The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4 STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5 POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6 INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
User’s Manual U18698EJ1V0UD
3


3Pages


UPD78F0410 電子部品, 半導体
Related Documents
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents Related to Devices
78K0/LC3 User’s Manual
78K/0 Series Instructions User’s Manual
Document Name
Document No.
This manual
U12326E
Documents Related to Flash Memory Programming
Document Name
PG-FP4 Flash Memory Programmer User’s Manual
PG-FPL3 Flash Memory Programmer User’s Manual
Document No.
U15260E
U17454E
Other Documents
Document Name
SEMICONDUCTOR SELECTION GUIDE Products and Packages
Semiconductor Device Mount Manual
Quality Grades on NEC Semiconductor Devices
NEC Semiconductor Device Reliability/Quality Control System
Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD)
Document No.
X13769X
Note
C11531E
C10983E
C11892E
Note See the “Semiconductor Device Mount Manual” website (http://www.necel.com/pkg/en/mount/index.html).
Caution The related documents listed above are subject to change without notice. Be sure to use the latest
version of each document when designing.
6 User’s Manual U18698EJ1V0UD

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
UPD78F0410

8-Bit Single-Chip Microcontrollers

NEC
NEC
UPD78F0411

8-Bit Single-Chip Microcontrollers

NEC
NEC
UPD78F0412

8-Bit Single-Chip Microcontrollers

NEC
NEC
UPD78F0413

8-Bit Single-Chip Microcontrollers

NEC
NEC


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