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PDF TSP730M Data sheet ( Hoja de datos )

Número de pieza TSP730M
Descripción N-Channel MOSFET
Fabricantes Truesemi 
Logotipo Truesemi Logotipo



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No Preview Available ! TSP730M Hoja de datos, Descripción, Manual

TSP730M / TSF730M
400V N-Channel MOSFET
General Description
This Pow er MOSFET is produced using Tr uesemi‘s
advanced planar stripe DMOS technology.
This advanced technology has been espe cially tailored to
minimize o n-state r esistance, pr ovide superior switching
performance, and withstand high ener gy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency sw itched mode power supp lies,
active power factor corr ection based on half br idge
topology.
Features
• 6.0A, 400V, RDS(on) = 1.00@VGS = 10 V
• Low gate charge ( typical 18nC)
• Fast wsitching
• 100% avalanche tested
• Improved dv/dt capability
{D
GDS
TO-220
GD S
TO-220F
◀▲
{G
{S
Absolute Maximum Ratings TC = 25°Cunless otherwise noted
Symbol
Parameter
VDSS
Drain-Source Voltage
ID Drain Current - Continuous (TC = 25°C)
- Continuous (TC = 100°C)
IDM Drain Current - Pulsed
(Note 1)
VGSS
Gate-Source Voltage
EAS Single Pulsed Avalanche Energy
(Note 2)
EAR Repetitive Avalanche Energy
(Note 1)
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
PD Power Dissipation (TC = 25°C)
- Derate above 25°C
TJ, TSTG
Operating and Storage Temperature Range
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol
RθJC
RθCS
RθJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink Typ.
Thermal Resistance, Junction-to-Ambient
TSP730M
TSF730M
400
6.0 6.0*
3.6 3.6 *
24 24*
± 30
288
7.6
4.5
76 40
0.6 0.32
-55 to +150
300
TSP730M
1.64
0.5
62.5
TSF730M
3.13
--
62.5
Units
V
A
A
A
V
mJ
mJ
V/ns
W
W/°C
°C
°C
Units
°C/W
°C/W
°C/W

1 page




TSP730M pdf
Typical Characteristics (Continued)
Figure 11-1. Transient Thermal Response Curve
for TSP730M
Figure 11-2. Transient Thermal Response Curve
for TSF730M

5 Page










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