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What is IAA110P?

This electronic component, produced by the manufacturer "IXYS", performs the same function as "Integrated Telecom Circuits".


IAA110P Datasheet PDF - IXYS

Part Number IAA110P
Description Integrated Telecom Circuits
Manufacturers IXYS 
Logo IXYS Logo 


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INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
100
35
Units
VP
mArms / mADC
Features
3750Vrms Input/Output Isolation
Three Functions in One Package
Bidirectional Current Sensing
Bidirectional Current Switching
FCC Compatible
No EMI/RFI Generation
Small 16-Pin SOIC Package (PCMCIA Compatible)
Machine Insertable, Wave Solderable
Tape & Reel Version Available
Applications
Telecommunications
Telecom Switching
Tip/Ring Circuits
Modem Switching (Laptop, Notebook, Pocket Size)
Hook Switch
Dial Pulsing
Ground Start
Ringing Injection
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment-Patient/Equipment Isolation
Security
Aerospace
Industrial Controls
IAA110P
Integrated Telecom Circuits
Description
The IAA110P Multifunction Telecom switch combines
two 350V normally open (1-Form-A) relays and one
optocoupler in a single package. The relays use
optically coupled MOSFET technology to provide
3750Vrms of input to output isolation. The efficient
MOSFET switches and photovoltaic die use IXYS
Integrated Circuits Division’s patented OptoMOS
architecture while the inputs' highly efficient GaAIAs
infrared LEDs control the outputs. The IAA110P
allows telecom circuit designers to combine
three discrete functions in a single component
that occupies less space than traditional discrete
component solutions.
Approvals
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1305490
EN/IEC 60950-1 Certified Component:
TUV Certificate: B 09 07 49410 006
Ordering Information
Part #
IAA110P
IAA110PTR
Description
16-Pin SOIC (50/Tube)
16-Pin SOIC (1000/Reel)
Pin Configuration
1
(N/C)
2
3
4
5
6
7
8
(N/C)
16
15 (Form A)
14
13
12 (Form A)
11
10
9
1. (N/C)
2. + LED - Form A Relay #1
3. – LED - Form A Relay #1
4. + LED - Form A Relay #2
5. – LED - Form A Relay #2
6. Emitter - Phototransistor
7. Collector - Phototransistor
8. (N/C)
9. LED - Phototransistor +/–
10. LED - Phototransistor –/+
11. Output - Form A Relay #2
12. Common Source Relay #2
13. Output - Form A Relay #2
14. Output - Form A Relay #1
15. Common Source Relay #1
16. Output - Form A Relay #1
Pb
DS-IAA110P-R05
e3
www.ixysic.com
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
1

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IAA110P equivalent
INTEGRATED CIRCUITS DIVISION
IAA110P
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
IAA110P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
IAA110P
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R05 www.ixysic.com
5


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Information Total 6 Pages
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Featured Datasheets

Part NumberDescriptionMFRS
IAA110PThe function is Integrated Telecom Circuits. Clare .Clare .
IAA110PThe function is Integrated Telecom Circuits. IXYSIXYS

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