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HS-26CLV31EH の電気的特性と機能

HS-26CLV31EHのメーカーはIntersilです、この部品の機能は「Radiation Hardened 3.3V Quad Differential Line Drivers」です。


製品の詳細 ( Datasheet PDF )

部品番号 HS-26CLV31EH
部品説明 Radiation Hardened 3.3V Quad Differential Line Drivers
メーカ Intersil
ロゴ Intersil ロゴ 




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HS-26CLV31EH Datasheet, HS-26CLV31EH PDF,ピン配置, 機能
Radiation Hardened 3.3V Quad Differential Line
Drivers
HS-26CLV31RH, HS-26CLV31EH
The Intersil HS-26CLV31RH, HS-26CLV31EH are radiation
hardened 3.3V quad differential line drivers designed for
digital data transmission over balanced lines, in low voltage,
RS-422 protocol applications. CMOS processing assures low
power consumption, high speed, and reliable operation in the
most severe radiation environments.
The HS-26CLV31RH, HS-26CLV31EH accept CMOS level inputs
and converts them to differential outputs. Enable pins allow
several devices to be connected to the same data source and
addressed independently. These devices have unique outputs that
become high impedance when the driver is disabled or
powered-down, maintaining signal integrity in multi-driver
applications.
Specifications for Rad Hard QML devices are controlled by the
Defense Logistics Agency Land and Maritime (DLA). The SMD
numbers listed here must be used when ordering.
Detailed Electrical Specifications for these devices are
contained in SMD 5962-96663.
Features
• Electrically screened to SMD # 5962-96663
• QML qualified per MIL-PRF-38535 requirements
• 1.2 micron radiation hardened CMOS
- Total dose . . . . . . . . . . . . . . . . . . . . . . . . 300 krad (Si) (max)
- Single event upset LET . . . . . . . . . . . . . 100MeV/mg/cm2)
- Single event latch-up immune
• Extremely low stand-by current . . . . . . . . . . . . . 100µA (max)
• Operating supply range . . . . . . . . . . . . . . . . . . . . . 3.0V to 3.6V
• CMOS level inputs . . . . . . .VIH > (0.7) (VDD); VIL < (0.3) (VDD)
• Differential outputs . . . . . . . . . . . . . . . VOH > 1.8V; VOL < 0.5V
• High impedance outputs when disabled or powered down
• Low output impedance . . . . . . . . . . . . . . . . . . . . . .10or less
• Full -55°C to +125°C military temperature range
• Pb-Free (RoHS Compliant)
Applications
• Line transmitter for MIL-STD-1553 serial data bus
Ordering Information
ORDERING NUMBER
(Note 1)
INTERNAL
MKT. NUMBER
PART
MARKING
TEMP. RANGE
PACKAGE
(°C) (RoHS Compliant)
PKG.
DWG. #
5962F9666302QEC
HS1-26CLV31RH-8
Q 5962F96 66302QEC
-55 to +125 16 Ld SBDIP
D16.3
5962F9666302QXC
HS9-26CLV31RH-8
Q 5962F96 66302QXC
-55 to +125 16 Ld FLATPACK K16.A
5962F9666302VEC
HS1-26CLV31RH-Q
Q 5962F96 66302VEC
-55 to +125 16 Ld SBDIP
D16.3
5962F9666302VXC
HS9-26CLV31RH-Q
Q 5962F96 66302VXC
-55 to +125 16 Ld FLATPACK K16.A
5962F9666302V9A
HS0-26CLV31RH-Q
-55 to +125 Die
HS1-26CLV31RH/PROTO
HS1-26CLV31RH/PROTO
HS1-26CLV31RH/PROTO -55 to +125 16 Ld SBDIP
D16.3
HS9-26CLV31RH/PROTO
HS9-26CLV31RH/PROTO
HS9-26CLV31RH/PROTO -55 to +125 16 Ld FLATPACK K16.A
5962F9666304VEC
HS1-26CLV31EH-Q
Q 5962F96 66304VEC
-55 to +125 16 Ld SBDIP
D16.3
5962F9666304VXC
HS9-26CLV31EH-Q
Q 5962F96 66304VXC
-55 to +125 16 Ld FLATPACK K16.A
5962F9666304V9A
HS0-26CLV31EH-Q
-55 to +125 Die
HS0-26CLV31RH/SAMPLE HS0-26CLV31RH/SAMPLE
-55 to +125 Die
5962F9666302VYC
HS9G-26CLV31RH-Q (Note 2)
Q 5962F96 66302VYC
-55 to +125 16 Ld FLATPACK K16.A
HS9G-26CLV31RH/PROTO HS9G-26CLV31RH/PROTO (Note 2) HS9G-26CLV31RH/PROTO -55 to +125 16 Ld FLATPACK K16.A
NOTES:
1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both
SnPb and Pb-free soldering operations.
2. The lid of these packages are connected to the ground pin of the device.
May 23, 2013
FN4898.4
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2000, 2008, 2009, 2012, 2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.

1 Page





HS-26CLV31EH pdf, ピン配列
HS-26CLV31RH, HS-26CLV31EH
Die Characteristics
DIE DIMENSIONS:
96.5 mil x 195 mils x 21 mils
(2450 x 4950)
INTERFACE MATERIALS:
Glassivation:
Type: PSG (Phosphorus Silicon Glass)
Thickness: 8kÅ ±1kÅ
Metallization:
Bottom: Mo/TiW
Thickness: 5800Å ±1kÅ
Top: AlSiCu (Top)
Thickness: 10kÅ ±1kÅ
Metallization Mask Layout
HS-26CLV31RH, HS-26CLV31EH
AO (2)
AO (3)
ENABLE (4)
BO (5)
BO (6)
(14) DO
(13) DO
(12) ENABLE
(11) CO
(10) CO
Substrate:
AVLSI1RA
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential (Powered Up):
VDD
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0 x 105A/cm2
Bond Pad Size:
110µm x 100µm
TABLE 1. HS-26CLV31RH, HS-26CLV31EH PAD COORDINATES
RELATIVE TO PIN 1
PIN
NUMBER
PAD
NAME
X COORDINATES Y COORDINATES
1 AIN 0 0
2 A0
0 -570.7
3 A0
0 -1483.5
4 ENABLE
0 -2124.8
5 B0
0 -2873.5
6 B0
0 -3786.3
7 BIN
0 -4357
8 GND
852.4
-4357
8
GND
1062.4
-4357
9
CIN
1912.8
-4357
10 C0
1912.8
-3786.3
11 C0
1912.8
-2873.5
12 ENABLE
1912.8
-2124.8
13 D0
1912.8
-1483.5
14 D0
1912.8
-570.7
15 DIN
1912.8
0
16 VIN
1062.4
0
16 VIN
852.4
0
NOTE: Dimensions in microns
3 FN4898.4
May 23, 2013


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部品番号部品説明メーカ
HS-26CLV31EH

Radiation Hardened 3.3V Quad Differential Line Drivers

Intersil
Intersil


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