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PDF ISL3232E Data sheet ( Hoja de datos )
| Número de pieza | ISL3232E | |
| Descripción | RS-232 Transmitters/Receiver | |
| Fabricantes | Intersil | |
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Data Sheet
ISL3232E, ISL4221E, ISL4223E
May 13, 2010
FN6045.6
QFN Packaged, ±15kV ESD Protected,
+2.7V to +5.5V, 150nA, 250kbps, RS-232
Transmitters/Receivers
The Intersil ISL3232E and ISL4221E, ISL4223E devices are
2.7V to 5.5V powered RS-232 transmitters/receivers which
meet ElA/TIA-232 and V.28/V.24 specifications, even at
VCC = 3.0V. Additionally, they provide ±15kV ESD protection
(IEC61000-4-2 Air Gap and Human Body Model) on
transmitter outputs and receiver inputs (RS-232 pins).
Targeted applications are PDAs, Palmtops, and hand-held
products where the low operational, and even lower standby,
power consumption is critical. Efficient on-chip charge pumps,
coupled with manual and automatic power-down functions,
reduce the standby supply current to a 150nA trickle. Tiny
5mmx5mm Quad Flat No-Lead (QFN) packaging and the
use of small, low value capacitors ensure board space
savings as well. Data rates greater than 250kbps are
guaranteed at worst case load conditions.
The ISL4221E is a 1 driver, 1 receiver device and the
ISL3232E and ISL4223E are 2 driver, 2 receiver devices
that, coupled with the 5mmx5mm QFN package, provide the
industry’s smallest, lowest power serial port suitable for
PDAs, and hand-held applications. The 5mmx5mm QFN
requires 40% less board area than a 20 Ld TSSOP, and is
nearly 20% thinner.
The ISL4221E, ISL4223E versions feature an automatic
power-down function that powers down the on-chip power
supply and driver circuits. This occurs when an attached
peripheral device is shut off or the RS-232 cable is removed,
conserving system power automatically without changes to
the hardware or operating system. It powers up again when
a valid RS-232 voltage is applied to any receiver input.
Table 1 summarizes the features of the IC’s, while
Application Note AN9863 summarizes the features of each
device comprising the 3V RS-232 family.
Features
• Available in Near Chip Scale QFN (5mmx5mm) Package,
which is 40% Smaller than a 20 Ld TSSOP
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000)
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• RS-232 Compatible with VCC = 2.7V
• On-Chip Voltage Converters Require Only Four External
0.1µF Capacitors
• Manual and Automatic Power-down Features (Except
ISL3232E)
• Receiver Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Wide Power Supply Range . . . . . . Single +2.7V to +5.5V
• Low Supply Current in Power-down State . . . . . . . .150nA
• Pb-Free Available (RoHS Compliant)
Applications
• Any Space Constrained System Requiring RS-232 Ports
- Battery Powered, and Portable Equipment
- Hand-Held Products (GPS Receivers, Bar Code
Scanners, etc.)
- PDAs and Palmtops, Data Cables
- Cellular/Mobile Phones, Digital Cameras
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
• Technical Brief TB379 “Thermal Characterization of
Packages for ICs”
• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN Packages”
TABLE 1. SUMMARY OF FEATURES
NO. OF NO. OF QFN PKG.
PART NUMBER Tx.
Rx. AVAILABLE?
DATA RATE
(kbps)
Rx. ENABLE
MANUAL
FUNCTION? POWER-DOWN?
ISL4221E
11
YES
250
YES
YES
ISL3232E
22
YES
250
NO
NO
ISL4223E
22
YES
250
YES
YES
AUTOMATIC POWER-DOWN
FUNCTION?
YES
NO
YES
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2007, 2008, 2010. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
1 page  
ISL3232E, ISL4221E, ISL4223E
Absolute Maximum Ratings
VCC to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, FORCEOFF, FORCEON, EN . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT, INVALID. . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
16 Ld QFN Package (Notes 1, 2). . . . .
35
4.3
20 Ld QFN Package (Notes 1, 2). . . . .
32
4.3
Maximum Junction Temperature (Plastic Package) . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTE:
1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379, and Tech Brief TB389.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
PARAMETER
Test Conditions: VCC = 3V to 5.5V, C1 through C4 = 0.1µF; Unless Otherwise Specified.
Typicals are at TA = +25°C
TEST CONDITIONS
TEMP MIN
(°C) (Note 4)
TYP
MAX
(Note 4) UNITS
DC CHARACTERISTICS
Supply Current, Automatic Power-down All RIN Open, FORCEON = GND, FORCEOFF = VCC 25
-
0.15
1 µA
(Except ISL3232E)
Supply Current, Power-down
FORCEOFF = GND (Except ISL3232E)
25 - 0.15 1 µA
Supply Current,
Automatic Power-down Disabled
All Outputs Unloaded,
VCC = 3.15V
FORCEON = FORCEOFF = VCC
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
25 -
0.3 1.0 mA
Input Logic Threshold Low
TIN, FORCEON, FORCEOFF, EN
Input Logic Threshold High
TIN, FORCEON, FORCEOFF, EN VCC = 3.3V
VCC = 5.0V
Input Leakage Current
TIN, FORCEON, FORCEOFF, EN
Output Leakage Current
EN = VCC (Except ISL3232E)
Output Voltage Low
IOUT = 1.6mA
Output Voltage High
IOUT = -1.0mA
AUTOMATIC POWER-DOWN (FORCEON = GND, FORCEOFF = VCC, Except ISL3232E)
Receiver Input Thresholds to Enable
Transmitters
ISL4221E, ISL4223E Powers Up (See Figure 6)
Full -
-
Full 2.0
-
Full 2.4
-
Full -
±0.01
Full -
±0.05
Full -
-
Full VCC - 0.6 VCC - 0.1
0.8
-
-
±1.0
±10
0.4
-
V
V
V
µA
µA
V
V
Full -2.7
-
2.7 V
Receiver Input Thresholds to Disable
Transmitters
ISL4221E, ISL4223E Powers Down (See Figure 6)
Full -0.3
-
0.3 V
INVALID Output Voltage Low
IOUT = 1.6mA
INVALID Output Voltage High
IOUT = -1.0mA
Receiver Threshold to Transmitters
Enabled Delay (tWU)
Receiver Positive or Negative Threshold
to INVALID High Delay (tINVH)
Receiver Positive or Negative Threshold
to INVALID Low Delay (tINVL)
Full -
Full VCC - 0.6
25 -
-
-
100
25 -
1
25 -
30
0.4 V
-V
- µs
- µs
- µs
5 FN6045.6
May 13, 2010
5 Page 
ISL3232E, ISL4221E, ISL4223E
Interconnection with 3V and 5V Logic
The ISL4221E, ISL4223E and ISL3232E directly interface
with 5V CMOS and TTL logic families. Nevertheless, with the
ISL4221E, ISL4223E and ISL3232E at 3.3V, and the logic
supply at 5V, AC, HC, and CD4000 outputs can properly
drive ISL4221E, ISL4223E and ISL3232E inputs, but
ISL4221E, ISL4223E and ISL3232E outputs do not reach
the minimum VIH for these logic families. See Table 3 for
more information.
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
SYSTEM
VCC
POWER-SUPPLY SUPPLY
VOLTAGE VOLTAGE
(V) (V)
COMPATIBILITY
3.3 3.3 Compatible with all CMOS
families.
5 5 Compatible with all TTL and
CMOS logic families.
5 3.3 Compatible with ACT and HCT
CMOS, and with TTL. ISL4221E,
ISL4223E and ISL3232E outputs
are incompatible with AC, HC,
and CD4000 CMOS inputs.
±15kV ESD Protection
All pins on ISL4221E, ISL4223E and ISL3232E devices
include ESD protection structures, but the RS-232 pins
(transmitter outputs and receiver inputs) incorporate
advanced structures, which allow them to survive ESD
events up to ±15kV. The RS-232 pins are particularly
vulnerable to ESD damage because they typically connect to
an exposed port on the exterior of the finished product.
Simply touching the port pins, or connecting a cable, can
cause an ESD event that might destroy unprotected ICs.
These new ESD structures protect the device whether or not
it is powered-up, protect without allowing any latchup
mechanism to activate, and don’t interfere with RS-232
signals as large as ±25V.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
IEC61000-4-2 Testing
The IEC61000-4-2 test method applies to finished
equipment, rather than to an individual IC. Therefore, the
pins most likely to suffer an ESD event are those that are
exposed to the outside world (the RS-232 pins in this case),
and the IC is tested in its typical application configuration
(power applied) rather than testing each pin-to-pin
combination. The lower current limiting resistor coupled with
the larger charge storage capacitor yields a test that is much
more severe than the HBM test. The extra ESD protection
built into this device’s RS-232 pins allows the design of
equipment meeting level 4 criteria without the need for
additional board level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
11 FN6045.6
May 13, 2010
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet ISL3232E.PDF ] | |
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