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MT6167のメーカーはMediaTekです、この部品の機能は「RF System」です。 |
部品番号 | MT6167 |
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部品説明 | RF System | ||
メーカ | MediaTek | ||
ロゴ | |||
このページの下部にプレビューとMT6167ダウンロード(pdfファイル)リンクがあります。 Total 30 pages
MT6167 RF System
Datasheet
Version:
Release date/Status:
Editor:
1.1
2012/11/15
Chi-Yao Yu
© 2012 MediaTek Inc.
This document contains information that is proprietary to MediaTek Inc.
[email protected],time=2013-01-20 00:44:07,ip=125.77.137.19,doctitle=MT6167 Datasheet V1p1.pdf,company=Lenovo_WCX
1 Page MT6167 Datasheet
Confidential A
1 Introduction
1.1 Overview
The MT6167 is an RF transceiver targeted at high speed 3G smart phone and tablet computers
implemented in 40nm CMOS. The RF transceiver function is fully integrated. This document
described the performance targets for the RF macro to be embedded in the overall product.
1.2 Key features
Full multi-mode RF solution (GGE/WCDMA) through to 3GPP Release 8 (HSPA+)
o 42.2Mbps peak DL (Cat. 24: 64QAM, Dual-Cell HSDPA)
o 11.5Mbps peak UL (Cat. 7: 16QAM)
o Supports receiver diversity (RxD)
o Quad-band support in GGE mode (GSM850/900/1800/1900)
o 3G bands support: Band I –VI , VIII-XI (including Softbank, JPN), XIX
Direct Conversion (3G), Two Point Modulation (TPM) for GMSK and Small Signal Polar for 8-
PSK
o No external SAW filters required for transmitter (WCDMA//GGE)
o Dedicated power detection circuits for 3G TX power control over specific power range
Hybrid Direct-Conversion (3G) / Low-IF (GGE, DC-HSDPA) receiver
o No external SAW filters required for receive (WCDMA/HSDPA)
o Flexible support for a variety of bands configuration (5 Rx & 3 RxD)
Quad-band Rx GGE co-banded with 4 Rx WCDMA/HSDPA/DC-HSPA bands
II,III,V,VIII
Additional Rx input for other 3G bands
Three RxD inputs can cover up to five bands through external band diplexing
Low supply current & operation directly from DC-DC converter
26MHz internal DCXO or external VCTCXO operation (with integrated AFC DAC)
o Three low noise additional Clock Drivers for clocking connectivity / peripheral IC’s
o Ultra Low power 32KHz mode
Support RF Calibration features for key Rx and Tx specifications (Image rejection, LO feed
through, DC offset)
Temperature Measurement sub-system
Version 1.1
[email protected],time=2013-01-20 00:44:07,ip=125.77.137.19,doctitle=MT6167 Datasheet V1p1.pdf,company=Lenovo_WCX
© MediaTek Inc. 15-Nov-12
Page 3 of 39
3Pages 3 General Specifications
3.1 Packaging
Wirebond TFBGA is currently considered for this product.
Parameter
Body Size
Ball Spacing
Ball number
Single die
4.6x4.6mm
0.4mm
11x11
MT6167 Datasheet
Confidential A
Version 1.1
[email protected],time=2013-01-20 00:44:07,ip=125.77.137.19,doctitle=MT6167 Datasheet V1p1.pdf,company=Lenovo_WCX
© MediaTek Inc. 15-Nov-12
Page 6 of 39
6 Page | |||
ページ | 合計 : 30 ページ | ||
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PDF ダウンロード | [ MT6167 データシート.PDF ] |
データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。 |
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