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PDF CD4007 Data sheet ( Hoja de datos )

Número de pieza CD4007
Descripción Dual Complementary Pair Plus Inverter
Fabricantes National Semiconductor 
Logotipo National Semiconductor Logotipo



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No Preview Available ! CD4007 Hoja de datos, Descripción, Manual

Data sheet acquired from Harris Semiconductor
SCHS018C – Revised September 2003
The CD4007UB types are supplied in 14-lead
hermetic dual-in-line ceramic packages
(F3A suffix), 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline
packages (M, MT, M96, and NSR suffixes),
and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
www.DataSheet4U.com
Copyright 2003, Texas Instruments Incorporated

1 page




CD4007 pdf
www.ti.com
PACKAGE OPTION ADDENDUM
www.DataSheet42U8.-cFoebm-2005
PACKAGING INFORMATION
Orderable Device
CD4007UBE
CD4007UBF
CD4007UBF3A
CD4007UBF3A116
CD4007UBM
CD4007UBM96
CD4007UBMT
CD4007UBNSR
CD4007UBPW
CD4007UBPWR
Status (1)
ACTIVE
Package
Type
PDIP
Package
Drawing
N
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
CDIP
CDIP
CDIP
SOIC
J
J
J
D
ACTIVE
SOIC
D
ACTIVE
SOIC
D
ACTIVE
SO
NS
ACTIVE TSSOP
PW
ACTIVE TSSOP
PW
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
14 25
Pb-Free
(RoHS)
CU NIPDAU Level-NC-NC-NC
14 1
None
Call TI
Level-NC-NC-NC
14 1
None
Call TI
Level-NC-NC-NC
14
None
Call TI
Call TI
14 50
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
14 2500
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
14 250
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
14 2000
Pb-Free
(RoHS)
CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
14 90
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
14 2000
Pb-Free
(RoHS)
CU NIPDAU Level-1-250C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1

5 Page





CD4007 arduino
IMPORTANT NOTICE
www.DataSheet4U.com
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
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is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
Data Converters
DSP
Interface
Logic
Power Mgmt
Microcontrollers
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
Applications
Audio
Automotive
Broadband
Digital Control
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated

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