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What is 9DBL08?

This electronic component, produced by the manufacturer "IDT", performs the same function as "8-output 3.3V PCIe Zero-Delay Buffer".


9DBL08 Datasheet PDF - IDT

Part Number 9DBL08
Description 8-output 3.3V PCIe Zero-Delay Buffer
Manufacturers IDT 
Logo IDT Logo 


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8-output 3.3V PCIe Zero-Delay Buffer
9DBL08
Description
The 9DBL08 devices are 3.3V members of IDT's
Full-Featured PCIe family. The 9DBL08 supports PCIe
Gen1-4 Common Clocked (CC) and PCIe Separate
Reference Independent Spread (SRIS) systems. It offers a
choice of integrated output terminations providing direct
connection to 85or 100transmission lines. The
9DBL08P1 can be factory programmed with a user-defined
power up default SMBus configuration.
Recommended Application
PCIe Gen1-4 clock distribution for Riser Cards, Storage,
Networking, JBOD, Communications, Access Points
Output Features
8 – 1-200 MHz Low-Power (LP) HCSL DIF pairs
9DBL0841 default ZOUT = 100
9DBL0851 default ZOUT = 85
9DBL08P1 factory programmable defaults
Easy AC-coupling to other logic families, see IDT
application note AN-891
Key Specifications
PCIe Gen1-2-3-4 CC compliant in ZDB mode
PCIe Gen2 SRIS compliant in ZDB mode
Supports PCIe Gen2-3 SRIS in fan-out mode
DIF cycle-to-cycle jitter <50ps
DIF output-to-output skew < 50ps
Bypass mode additive phase jitter is 0 ps typical rms for
PCIe
Bypass mode additive phase jitter 160fs rms typ. @
156.25M (1.5M to 10M)
Block Diagram
DATASHEET
Features/Benefits
Direct connection to 100(0841) or 85(0851)
transmission lines; saves 32 resistors compared to
standard PCIe devices
211mW typical power consumption (PLL [email protected]);
eliminates thermal concerns
VDDIO allows 35% power savings at optional 1.05V;
maximum power savings
SMBus-selectable features allows optimization to customer
requirements:
control input polarity
control input pull up/downs
slew rate for each output
differential output amplitude
output impedance for each output
50, 100, 125MHz operating frequency
Customer defined SMBus power up default can be
programmed into P1 device; allows exact optimization to
customer requirements
OE# pins; support DIF power management
HCSL-compatible differential input; can be driven by
common clock sources
Spread Spectrum tolerant; allows reduction of EMI
Pin/SMBus selectable PLL bandwidth and PLL Bypass;
minimize phase jitter for each application
Outputs blocked until PLL is locked; clean system start-up
Device contains default configuration; SMBus interface not
required for device operation
Three selectable SMBus addresses; multiple devices can
easily share an SMBus segment
Space saving 48-pin 6x6mm VFQFPN; minimal board
space
vOE(7:0)#
XIN/CLKIN_25
X2
OSC
vSADR
vSS_EN_tri
^CKPWRGD_PD#
SDATA_3.3
SCLK_3.3
CONTROL
LOGIC
SS Capable PLL
REF3.3
DIF7
DIF6
DIF5
DIF4
DIF3
DIF2
DIF1
DIF0
Note: Resistors default to internal on 41/51 devices. P1 devices have programmable default impedances on an output-by-output basis.
9DBL08 REVISION D 08/16/16
1 ©2016 Integrated Device Technology, Inc.

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9DBL08 equivalent
9DBL08 DATASHEET
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the 9DBL08. These ratings, which are standard values
for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions
above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended
operating temperature range.
PARAMETER
SYMBOL
CONDITIONS
Supply Voltage
VDDx
Input Voltage
VIN
Input High Voltage, SMBus VIHSMB
Storage Temperature
Ts
SMBus clock and data pins
Junction Temperature
Tj
Input ESD protection
ESD prot
Human Body Model
1Guaranteed by design and characterization, not 100% tested in production.
2 Operation under these conditions is neither implied nor guaranteed.
3 Not to exceed 4.6V.
MIN
-0.5
-65
2500
Electrical Characteristics–SMBus Parameters
TA = TAMB; Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
SMBus Input Low Voltage VILSMB
VDDSMB = 3.3V
SMBus Input High Voltage VIHSMB
VDDSMB = 3.3V
SMBus Output Low Voltage VOLSMB
@ IPULLUP
SMBus Sink Current
IPULLUP
@ VOL
Nominal Bus Voltage
VDDSMB
SCLK/SDATA Rise Time
tRSMB
(Max VIL - 0.15) to (Min VIH + 0.15)
SCLK/SDATA Fall Time
tFSMB
(Min VIH + 0.15) to (Max VIL - 0.15)
SMBus Operating
Frequency
fSMB
SMBus operating frequency
1 Guaranteed by design and characterization, not 100% tested in production.
2. The device must be powered up for the SMBus to function.
3. The differential input clock must be running for the SMBus to be active
Electrical Characteristics–Clock Input Parameters
2.1
4
2.7
TA = TAMB, Supply Voltages per normal operation conditions, See Test Loads for Loading Conditions
PARAMETER
SYMBOL
CONDITIONS
MIN
Input Crossover Voltage -
DIF_IN
VCROSS
Cross Over Voltage
150
Input Swing - DIF_IN
Input Slew Rate - DIF_IN
VSWING
dv/dt
Differential value
Measured differentially
300
0.4
Input Leakage Current
IIN
VIN = VDD , VIN = GND
Input Duty Cycle dtin Measurement from differential wavefrom
Input Jitter - Cycle to Cycle JDIFIn
Differential Measurement
1 Guaranteed by design and characterization, not 100% tested in production.
2Slew rate measured through +/-75mV window centered around differential zero
-5
45
0
TYP
MAX
4.6
VDD+0.5
3.9
150
125
UNITS NOTES
V 1,2
V 1,3
V1
°C 1
°C 1
V1
TYP
MAX
0.8
3.6
0.4
3.6
1000
300
500
UNITS NOTES
V
V
V
mA
V
ns 1
ns 1
kHz 2,3
TYP
MAX
900
8
5
55
125
UNITS NOTES
mV 1
mV
V/ns
uA
%
ps
1
1,2
1
1
REVISION D 08/16/16
5 8-OUTPUT 3.3V PCIE ZERO-DELAY BUFFER


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