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PDF LV47022P Data sheet ( Hoja de datos )
| Número de pieza | LV47022P | |
| Descripción | 4-Channel BTL Power Amplifier | |
| Fabricantes | Sanyo | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LV47022P (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
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Ordering number : ENA2047
LV47022P
Monolithic Linear IC
For Car Audio Systems
4-Channel BTL Power Amplifier
Overview
The LV47022P is the IC for 4-channel BTL power amplifier that is developed for car audio system.
Pch DMOS in the upper side of the output stage and Nch DMOS in the lower side of the output stage are complimentary.
High power and high quality sound are realized by that.
This IC incorporate various functions (standby switch, muting function, and various protection circuit) necessary for car
audio system. Also, it has a self-diagnosis function.
Functions
• High output : PO max = 48W (typical) (VCC = 15.2V, f = 1kHz, RL = 4Ω, Max Power)
: PO max = 28W (typical) (VCC = 14.4V, f = 1kHz, THD = 10%, RL = 4Ω)
: PO max = 21W (typical) (VCC = 14.4V, f = 1kHz, THD = 1%, RL = 4Ω)
• Built-in muting function (pin 22)
• Built-in Standby switch (pin 4)
• Built-in Self-diagnosis function (pin 25) :
Signal output in case of output offset detection, shorting to VCC, shorting to ground, load shorting and over voltage.
• Circuit that decrease of Electric mirror noise and GSM noise.
• Built-in various protection circuit (shorting to ground, shorting to VCC, load shorting, over voltage and thermal shut
down)
Note 1 : Please do not mistake connection.
A wrong connection may produce destruction, deterioration and damage for the IC or equipment.
Note 2 : The protective circuit function is provided to temporarily avoid abnormal state such as incorrect output connection.
But, there is no guarantee that the IC is not destroyed by the accident.
The protective function do not operate of the operation guarantee range. If the outputs are connected incorrectly, IC
destruction may occur when used outside of the operation guarantee range.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment. The products mentioned herein
shall not be intended for use for any "special application" (medical equipment whose purpose is to sustain life,
aerospace instrument, nuclear control device, burning appliances, transportation machine, traffic signal system,
safety equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives
in case of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any
guarantee thereof. If you should intend to use our products for new introduction or other application different
from current conditions on the usage of automotive device, communication device, office equipment, industrial
equipment etc. , please consult with us about usage condition (temperature, operation time etc.) prior to the
intended use. If there is no consultation or inquiry before the intended use, our customer shall be solely
responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer's products or
equipment.
40412 SY 20120328-S00001 No.A2047-1/12
1 page  
LV47022P
Explanation for the function
1. Standby switch function (pin 4)
Threshold voltage of the Pin 4 is set by about 2VBE.
The amplifier is turned on by the applied voltage of 2.5V or more. Also, the amplifier is turned off by the applied
voltage of 0.5V or less.
STBY 4
Fig1 Standby equivalent circuit
2. Muting function (Pin 22)
The muting function is turned on by the applied voltage of 1.0V or less to 22pin. And the muting function is turn off by
the applied voltage 2.9V or more.
Also, the time constant of the muting function is determined by external capacitor and resistor constants.
It is concerned with mute ON/OFF. After enough examination, please set it.
Switching time
Mute ON: C9 × R1
Mute OFF: (C9 × V) / I (V= When Mute ON Pin 22 voltage, I=about 5μA)
MUTE
22
R1
+ C9
MUTE
OFF
ON
about
2.1V
Fig2 Mute equivalent circuit
3. Input pin (Pin 11/ Pin 12/ Pin 14/ Pin 15), ACGND pin (Pin 16)
The ratio of the input capacitance (C1 to C4) to the ACGND capacitance (C5) should be 1:4.
Please use same kind of capacitor.
Please connect the ACGND capacitor to PREGND.
It is all five pin 100kΩ of input resistance.
Do not input below 0V to Pin-IN (Pin 11/ Pin12/ Pin 14/ Pin15).
If you input below 0V to Pin-IN, LV47022P can not function well.
No.A2047-5/12
5 Page 
LV47022P
HZIP25 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a. Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b. Heat sink attachment
· Use flat-head screws to attach heat sinks.
· Use also washer to protect the package.
· Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
· If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
· Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Take care a position of via hole .
· Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
· Verify that there are no press burrs or screw-hole burrs on the heat sink.
· Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
· Twisting must be limited to under 0.05 mm.
· Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
· The speed of these torque wrenches should never exceed 700 rpm, and
should typically be about 400 rpm.
Binding head
machine screw
Heat sink
gap
Via hole
Countersunk head
mashine screw
c. Silicone grease
· Spread the silicone grease evenly when mounting heat sinks.
· Sanyo recommends YG-6260 (Momentive Performance Materials Japan LLC)
d. Mount
· First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
· When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e. When mounting the semiconductor device to the heat sink using jigs, etc.,
· Take care not to allow the device to ride onto the jig or positioning dowel.
· Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor device.
f. Heat sink screw holes
· Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
· When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
· When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g. There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
PS No.A2047-11/12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet LV47022P.PDF ] | |
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