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RT5370 の電気的特性と機能

RT5370のメーカーはRalinkです、この部品の機能は「highly integrated MAC/BBP and 2.4 GHz RF/PA/LNA single chip」です。


製品の詳細 ( Datasheet PDF )

部品番号 RT5370
部品説明 highly integrated MAC/BBP and 2.4 GHz RF/PA/LNA single chip
メーカ Ralink
ロゴ Ralink ロゴ 




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RT5370 Datasheet, RT5370 PDF,ピン配置, 機能
IIIIIII
Application
IEEE802.11 b/g/n Wireless Local Area Networks
USB 2.0 Wi-Fi Dongle.
RT5370
Datasheet
Revision August 30, 2010
Product Description
The RT5370 is a highly integrated MAC/BBP and 2.4
GHz RF/PA/LNA single chip with 150Mbps PHY rate
supporting. It fully complies with IEEE 802.11n and IEEE
802.11 b/g feature rich wireless connectivity at high
standards, delivers reliable, cost-effective, throughput
from an extended distance. Optimized RF architecture
and baseband algorithms provide superb performance
and low power consumption. Intelligent MAC design
deploys a high efficient DMA engine and hardware data
processing accelerators without overloading the host
processor. The RT5370 is designed to support standard
based features in the areas of security, quality of
service and international regulation, giving end users
the greatest performance anytime in any circumstance.
Features
CMOS Technology with PA, LNA, RF, Baseband,
and MAC Integrated.
1T1R Mode with 150Mbps PHY Rate for Both
Transmit and Receiving.
Legacy and High Throughput Modes
20MHz/40MHz Bandwidth
Reverse Direction Grant Data Flow and Frame
Aggregation
WEP 64/128, WPA, WPA2,TKIP, AES, WAPI
QoS-WMM, WMM-PS
WPS,PIN,PBC
Multiple BSSID Support
Functional Block Diagram
USB 2.0
Cisco CCX Support
Bluetooth Co-existence
Low Power with Advanced Power Management
Operating Systems - Windows XP 32/64, 2000,
Windows 7,Vista 32/64 , Linux, Macintosh
Order Information
Part Number Temp Range
RT5370N
-10~70
Package
Green/RoHS
Compliant 52LD QFN
(7.5mmx5.7mm)
Ralink Technology, Corp. (Taiwan)
5th F. No. 36, Taiyuan St, Jhubei City, Hsin-Chu,
Taiwan, R.O.C.
Tel: 886-3-567-8868 Fax: 886-3-567-8818
Ralink Technology, Corp. (USA)
20833 Stevens Creek Blvd, Suite 200
Cupertino CA 95014
Tel: (408) 725-8070 Fax: (408)725-8069
http://www.ralinktech.com
RF_2G_INP/
RF_2G_INN
RF_PA_OUTP/
RF_PA_OUTN
LNA
PA
RF
receiver
RF
transmitter
Baseband
MAC/
Packet
Buffer/
Encrption
Engine
USB
System
Control
USB bus
EEPROM/GPIO
/LED
digital controlled
RF
DSRT5370_V1.0_083010
Form No.QS-073-F02
Rev.1
-I-
Kept byDCC
Ret. Time5 Years

1 Page





RT5370 pdf, ピン配列
1111111
1. Pin Layout
1.1 Pin Layout
RT5370
Datasheet
Revision August 30, 2010
RF_I NN
RF_I NP
V12A
PA_V33P
PA_OUTP
PA_OUTN
PA_V33N
V33A
VDD
VCCIO
RST_N
52 51 50 49 48 47 46 45 44 43 42 41 40 39 38
1 37
2 36
3 35
4 34
5 33
6
RT5370
32
7 31
8 30
9 29
10 28
11 27
12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
V12A
V12A
VDD
GPIO7
GPIO6
GPIO5
GPIO4
GPIO1
GPIO0
LED_RDYG_N
LED_ACT_N
DSRT5370_ V1. 0_100709
Form No.QS-073-F02
Rev.1
Kept byDCC
-1-
Ret. Time5 Years


3Pages


RT5370 電子部品, 半導体
RT5370
Datasheet
2 Maximum Ratings and Operating Conditions Absolute Maximum Ratings
Revision August 30, 2010
Supply Voltage …………………………………....…….……………………………………………..…………..….…………….………………..….. 1.38V
I/O Supply Voltage…..……………………………………..………………………………….……………………….…………….…………..….……... 3.6V
Input, Output or I/O Voltage……..……………………………..……………..……………………..………………...... GND 0.3V to Vcc+0.3V
2.2 Thermal Information
Maximum Junction Temperature (Plastic Package) ……….......…………….……...........................….……..………..……… 125°C
Maximum Storage Temperature Range …………………………….……………….………………………………...…….. 40 °C to 150 °C
Maximum Lead Temperature (Soldering 10s)………………..………..…….....….......……..…………………………………………… 260°C
Thermal characteristics without external heat sink in still air condition
.………………………….....………..… 25.36°C /W
..…………….…………..……………… 21.38°C /W
Thermal
.……….…….………………....……. 9.31°C /W
...………………….... 8.63°C /W
Thermal Characterization parameter ΨJt (°C /W) for JEDEC 2L system PCB ………..……………………......…….. 1.32°C /W
Thermal Characterization parameter ΨJt (°C /W) for JEDEC 4L system PCB ……………..…………………...…….. 1.11°C /W
Note: JEDEC 51-9 system FR4 PCB size: 3”x4.5” (76.2x114.3mm)
2.3 Operating Conditions
Ambient Temperature Range …………………....…………….......…......………..………………………………..……........... -10 to 70°C
Core Supply Voltage………………………......……....…….………………..……….…………………………...……..……...….… 1.14V to 1.38V
I/O Supply Voltage …………………….…………………….......……......…………..………………………...………….......………... 3.0V to 3.6V
2.4 Storage Condition
The calculated shelf life in sealed bag is 12 months if stored between 0°C and 40°C at less than 90% relative
humidity (RH). After the bag is opened, devices that are subjected to solder reflow or other high temperature
processes must be handled in the following manner:
a) Mounted within 168-hours of factory conditions < 30 °C /60%RH
b) Storage humidity needs to maintained at <10% RH
c) Baking is necessary if customer expose the component to air over 168 hrs, baking condition: 125°C / 8hrs
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
2.5 DC Electrical Characteristics
Parameters
3.3V Supply Voltage
1.2V Supply Voltage
Receiving
3.3V Current Consumption
1.2V Current Consumption
Transmission
3.3V Current Consumption
1.2V Current Consumption
Sym
Vcc33
Vcc12
Icc33rx
Icc12rx
Icc33tx
Icc12tx
Conditions
HT40 MCS7
HT40 MCS7
HT40 MCS7
HT40 MCS7
Min
Typ Max
Unit
3.0
3.3 3.6
V
1.14
1.2 1.38
V
35 mA
190 mA
230 mA
110 mA
DSRT5370_ V1. 0_083010
Form No.QS-073-F02
Rev.1
Kept byDCC
-4-
Ret. Time5 Years

6 Page



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共有リンク

Link :


部品番号部品説明メーカ
RT5370

highly integrated MAC/BBP and 2.4 GHz RF/PA/LNA single chip

Ralink
Ralink
RT5370N

highly integrated MAC/BBP and 2.4 GHz RF/PA/LNA single chip

Ralink
Ralink


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