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PDF AOZ1073 Data sheet ( Hoja de datos )

Número de pieza AOZ1073
Descripción 3A Synchronous Buck Regulator
Fabricantes Alpha & Omega Semiconductors 
Logotipo Alpha & Omega Semiconductors Logotipo



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AOZ1073
EZBuck™ 3A Synchronous Buck Regulator
General Description
The AOZ1073 is a synchronous high efficiency, simple
to use, 3A buck regulator. The AOZ1073 works from a
4.5V to 16V input voltage range, and provides up to 3A
of continuous output current with an output voltage
adjustable down to 0.8V.
The AOZ1073 comes in an SO-8 packages and is rated
over a -40°C to +85°C ambient temperature range.
Features
4.5V to 16V operating input voltage range
Synchronous rectification: 85minternal high-side
switch and 30mInternal low-side switch
High efficiency: up to 95%
Internal soft start
Output voltage adjustable to 0.8V
3A continuous output current
Fixed 500kHz PWM operation
Cycle-by-cycle current limit
Pre-bias start-up
Short-circuit protection
Thermal shutdown
Output over voltage protection
Small size SO-8 package
Applications
Point of load DC/DC conversion
PCIe graphics cards
Set top boxes
DVD drives and HDD
LCD panels
Cable modems
Telecom/networking/datacom equipment
Typical Application
VIN
C1
22µF
Ceramic
RC
CC
VIN
EN
AOZ1073 LX
COMP
FB
AGND
PGND
L1 4.7µH
R1
R2
VOUT
C2, C3
22µF Ceramic
Rev. 1.1 September 2008
Figure 1. 3.3V/3A Buck Regulator
www.aosmd.com
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AOZ1073 pdf
AOZ1073
Typical Performance Characteristics
Circuit of Figure 1. TA = 25°C, VIN = VEN = 12V, VOUT = 3.3V unless otherwise specified.
Light Load Operation
Full Load (CCM) Operation
Vin ripple
0.1V/div
Vo ripple
20mV/div
IL
1A/div
VLX
10V/div
1µs/div
1µs/div
Vin ripple
0.1V/div
Vo ripple
20mV/div
IL
1A/div
VLX
10V/div
Startup to Full Load
Vin
10V/div
Short Circuit Protection
LX
10V/div
Vo
2V/div
1ms/div
50% to 100% Load Transient
lin
1A/div
Vo Ripple
100mV/div
lo
1A/div
100µs/div
Short Circuit Recovery
Vo
2V/div
IL
2A/div
LX
10V/div
Vo
2V/div
IL
2A/div
100µs/div
2ms/div
Rev. 1.1 September 2008
www.aosmd.com
Page 5 of 15

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AOZ1073 arduino
AOZ1073
Thermal Management and Layout
Consideration
In the AOZ1073 buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the VIN pin, to the LX
pins, to the filter inductor, to the output capacitor and
load, and then return to the input capacitor through
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the
output capacitors and load, to the anode of Schottky
diode, to the cathode of Schottky diode. Current flows in
the second loop when the low side diode is on.
In PCB layout, minimizing the two loops area reduces the
noise of this circuit and improves efficiency. A ground
plane is strongly recommended to connect input capaci-
tor, output capacitor, and PGND pin of the AOZ1073.
In the AOZ1073 buck regulator circuit, the major power
dissipating components are the AOZ1073 and the output
inductor. The total power dissipation of converter circuit
can be measured by input power minus output power.
P total _loss = V IN × I IN V O × I O
The power dissipation of inductor can be approximately
calculated by output current and DCR of inductor.
P inductor _loss = IO2 × R inductor × 1.1
The actual junction temperature can be calculated with
power dissipation in the AOZ1073 and thermal imped-
ance from junction to ambient.
T junction = (P total _lossP inductor _loss) × ΘJA
The maximum junction temperature of AOZ1073 is
150°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1073 under different ambient
temperature.
The thermal performance of the AOZ1073 is strongly
affected by the PCB layout. Extra care should be taken
by users during design process to ensure that the IC
will operate under the recommended environmental
conditions.
The AOZ1073 is a standard SO-8 package. Layout tips
are listed below for the best electric and thermal
performance. Figure 3 illustrates a PCB layout example
of the AOZ1073.
1. Do not use thermal relief connection to the VIN
and the PGND pin. Pour a maximized copper area
to the PGND pin and the VIN pin to help thermal
dissipation.
2. Input capacitor should be connected as close as
possible to the VIN pin and the PGND pin.
3. A ground plane is suggested. If a ground plane is
not used, separate PGND from AGND and connect
them only at one point to avoid the PGND pin noise
coupling to the AGND pin.
4. Make the current trace from the LX pins to L to CO to
the PGND as short as possible.
5. Pour copper plane on all unused board area and
connect it to stable DC nodes, like VIN, GND or VOUT.
6. The LX pins are connected to internal PFET drain.
They are a low resistance thermal conduction path
and the most noisy switching node. Connect a
copper plane to the LX pins to help thermal
dissipation. This copper plane should not be too
large otherwise switching noise may be coupled to
other parts of the circuit.
7. Keep sensitive signal traces far away from the LX
pins.
Rev. 1.1 September 2008
www.aosmd.com
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