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CPC1998 の電気的特性と機能

CPC1998のメーカーはIXYSです、この部品の機能は「AC Power Switch」です。


製品の詳細 ( Datasheet PDF )

部品番号 CPC1998
部品説明 AC Power Switch
メーカ IXYS
ロゴ IXYS ロゴ 




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CPC1998 Datasheet, CPC1998 PDF,ピン配置, 機能
INTEGRATED CIRCUITS DIVISION
Characteristics
Parameter
AC Operating Voltage
Load Current
With 5°C/W Heat Sink
No Heat Sink
On-State Voltage Drop
Blocking Voltage
Thermal Resistance,
Junction-to-Case, JC
Rating
20-240
20
5
1.1
800
0.35
Units
Vrms
Arms
VP (at IL=2AP)
VP
°C/W
Features
Load Current up to 20Arms with 5°C/W Heat Sink
800VP Blocking Voltage
5mA Control Current
Zero-Cross Switching
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
2500Vrms Isolation, Input to Output
DC Control, AC Output
Optically Isolated
TTL and CMOS Compatible
Low EMI and RFI Generation
High Noise Immunity
Machine Insertable, Wave Solderable
Applications
Programmable Control
Process Control
Power Control Panels
Remote Switching
Gas Pump Electronics
Contactors
Large Relays
Solenoids
Motors
Heaters
Approvals
UL 508 Recognized Component: File E69938
CPC1998
AC Power Switch
Description
CPC1998J is an AC Solid State Switch utilizing dual
power SCR outputs. This device also includes
zero-cross turn-on circuitry and is specified with an
800VP blocking voltage.
Tightly controlled zero-cross circuitry ensures low
noise switching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide exceptional noise immunity
and 2500Vrms of isolation between the control and the
output. As a result, the CPC1998 is well suited for
industrial environments where electromagnetic
interference would disrupt the operation of plant facility
communications and control systems.
The unique i4-PAC package pioneered by IXYS allows
Solid State Relays to achieve the highest load current
and power ratings. This package features a unique
IXYS process in which the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Part
CPC1998J
Description
i4-PAC Package (25 per tube)
Pin Configuration
ZC
12
AC Load
34
+ LED – LED
DS-CPC1998-R05
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CPC1998 pdf, ピン配列
INTEGRATED CIRCUITS DIVISION
CPC1998
2 Thermal Characteristics
Parameter
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
Conditions
-
Free Air
-
Symbol
JC
JA
TJ
Rating
0.35
33
-40 to +125
Units
°C/W
°C/W
°C
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θCA =
(TJ - TA)
PD
-
θJC
TJ = Junction Temperature (°C), TJ 125°C *
TA = Ambient Temperature (°C)
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD = On-State Voltage (Vrms) • Load Current (Arms)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
2.3 Thermal Performance Data
40
35
30
25
20
15
10
5
0
0
Output Power
vs. Load Current
5 10 15 20 25 30 35 40 0
Load Current (Arms)
Output Power
vs. Ambient Temperature
Heat Sink
1ºC/W
2ºC/W
5ºC/W
10ºC/W
15ºC/W
Free Air
40
35
30
25
20
15
10
5
25 50 75 100
Temperature (ºC)
0
125
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CPC1998 電子部品, 半導体
INTEGRATED CIRCUITS DIVISION
CPC1998
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1998J
Moisture Sensitivity Level (MSL) Rating
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
CPC1998J
Maximum Temperature x Time
245°C for 30 seconds
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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部品番号部品説明メーカ
CPC1998

AC Power Switch

IXYS
IXYS
CPC1998

AC Power Switch

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