PDF IS45R32160F Data sheet ( Hoja de datos )

Número de pieza	IS45R32160F
Descripción	512Mb SDRAM
Fabricantes	ISSI
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IS42/45R86400F/16320F/32160F IS42/45S86400F/16320F/32160F 16Mx32, 32Mx16, 512Mb SDRAM 64Mx8 ADVANCED INFORMATION NOVEMBER 2013 DEVICE OVERVIEW FEATURES • Clock frequency: 200, 166, 143 MHz • Fully synchronous; all signals referenced to a positive clock edge • Internal bank for hiding row access/precharge • Power supply: Vdd/Vddq = 2.3V-3.6V IS42/45SxxxxxD - Vdd/Vddq = 3.3V IS42/45RxxxxxD - Vdd/Vddq = 2.5 • LVTTL interface • Programmable burst length – (1, 2, 4, 8, full page) • Programmable burst sequence: Sequential/Interleave • Auto Refresh (CBR) • Self Refresh • 8K refresh cycles every 64 ms • Random column address every clock cycle • Programmable CAS latency (2, 3 clocks) • Burst read/write and burst read/single write operations capability • Burst termination by burst stop and precharge command • Packages: x8/x16: 54-pin TSOP-II, 54-ball TF-BGA (x16 only) x32: 90-ball TF-BGA, 86-pin TSOP-ll • Temperature Range: Commercial (0oC to +70oC) Industrial (-40oC to +85oC) Automotive, A1 (-40oC to +85oC) Automotive, A2 (-40oC to +105oC) ISSI's 512Mb Synchronous DRAM achieves high-speed data transfer using pipeline architecture. All inputs and outputs signals refer to the rising edge of the clock input. The 512Mb SDRAM is organized as follows. PACKAGE INFORMATION IS42/45S32160D IS42/45R32160D IS42/45S16320D IS42/45R16320D 4M x 32 x 4 banks 8M x 16 x 4 banks 90-ball TF-BGA 54-pin TSOP-II 86-pin TSOP-ll 54-ball TF-BGA IS42/45S86400D IS42/45R86400D 16M x 8 x 4 banks 54-pin TSOP-II KEY TIMING PARAMETERS Parameter Clk Cycle Time CAS Latency = 3 CAS Latency = 2 Clk Frequency CAS Latency = 3 CAS Latency = 2 Access Time from Clock CAS Latency = 3 CAS Latency = 2 -5 5 10 200 100 5.0 6 -6 -7 Unit 6 7 ns 10 7.5 ns 167 143 Mhz 100 133 Mhz 5.4 5.4 ns 6 5.4 ns ADDRESS TABLE Parameter 16M x 32 Configuration 4M x 32 x 4 banks Bank Address BA0, BA1 Pins Autoprecharge A10/AP Pins Row Address 8K(A0 – A12) 32M x 16 8M x 16 x 4 banks BA0, BA1 A10/AP 8K(A0 – A12) 64M x 8 16M x 8 x 4 banks BA0, BA1 A10/AP 8K(A0 – A12) Column Address 512(A0 – A8) 1K(A0 – A9) 2K(A0 – A9, A11) Refresh Count Com./Ind./A1 8K / 64ms A2 8K / 16ms 8K / 64ms 8K / 16ms 8K / 64ms 8K / 16ms Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with- out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such ap- plications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. — www.issi.com 1 Rev. 00A 11/5/2013 1 page IS42/45R86400F/16320F/32160F, IS42/45S86400F/16320F/32160F PIN CONFIGURATIONS 86 pin TSOP - Type II for x32 VDD DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 DQ4 VDDQ DQ5 DQ6 VSSQ DQ7 NC VDD DQM0 WE CAS RAS CS A11 BA0 BA1 A10 A0 A1 A2 DQM2 VDD NC DQ16 VSSQ DQ17 DQ18 VDDQ DQ19 DQ20 VSSQ DQ21 DQ22 VDDQ DQ23 VDD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 PIN DESCRIPTIONS A0-A12 Row Address Input A0-A8 Column Address Input BA0, BA1 Bank Select Address DQ0 to DQ31 Data I/O CLK System Clock Input CKE Clock Enable CS Chip Select RAS Row Address Strobe Command CAS Column Address Strobe Command 86 VSS 85 DQ15 84 VSSQ 83 DQ14 82 DQ13 81 VDDQ 80 DQ12 79 DQ11 78 VSSQ 77 DQ10 76 DQ9 75 VDDQ 74 DQ8 73 NC 72 VSS 71 DQM1 70 NC 69 A12 68 CLK 67 CKE 66 A9 65 A8 64 A7 63 A6 62 A5 61 A4 60 A3 59 DQM3 58 VSS 57 NC 56 DQ31 55 VDDQ 54 DQ30 53 DQ29 52 VSSQ 51 DQ28 50 DQ27 49 VDDQ 48 DQ26 47 DQ25 46 VSSQ 45 DQ24 44 VSS WE DQM0-DQM3 Vdd Vss Vddq Vssq NC Write Enable x32 Input/Output Mask Power Ground Power Supply for I/O Pin Ground for I/O Pin No Connection Integrated Silicon Solution, Inc. — www.issi.com 5 Rev. 00A 11/5/2013 5 Page IS42/45R86400F/16320F/32160F, IS42/45S86400F/16320F/32160F CKE TRUTH TABLE Current State /Function Activating Clock suspend mode entry Any Clock suspend mode Clock suspend mode exit Auto refresh command Idle (REF) Self refresh entry Idle (SELF) Power down entry Idle Self refresh exit Power down exit Note: H=Vih, L=Vil x= Vih or Vil, V = Valid Data. CKE n–1 n H L L L L H H H H L H L L H L H L H CS RAS CAS WE Address × × × × × × × × × × × × × × × L L L H × L L L H × × × × × × L H H H H × × × × × × × × × × Integrated Silicon Solution, Inc. — www.issi.com 11 Rev. 00A 11/5/2013 11 Page

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