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PDF K4N56163QG Data sheet ( Hoja de datos )

Número de pieza K4N56163QG
Descripción 256Mbit gDDR2 SDRAM
Fabricantes Samsung 
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K4N56163QG
256M gDDR2 SDRAM
256Mbit gDDR2 SDRAM
Revision 1.4
December 2006
Notice
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
- 1/64 -
Rev. 1.4 Dec. 2006

1 page




K4N56163QG pdf
K4N56163QG
5.0 PACKAGE DIMENSIONS (84 Ball FBGA)
11.00 ± 0.10
6.40
0.80 1.60
987654321
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
84-0.45±0.05
0.2 M A B
3.20
(0.90)
(1.80)
(5.5)
256M gDDR2 SDRAM
# A1 INDEX MARK (OPTIONAL)
11.00 ± 0.10
#A1
- 5/64 -
0.35±0.05
MAX.1.20
Unit : mm
Rev. 1.4 Dec. 2006

5 Page





K4N56163QG arduino
K4N56163QG
256M gDDR2 SDRAM
9.3 Timing Parameters by Speed Grade
(Refer to notes for informations related to this table at the bottom)
Parameter
- 20 - 22 - 25 - 2A
Symbol
Units Notes
min max min max min max min max
DQ output access time from CK/CK
tAC -350 +350 -350 +350 -400 +400 -450 +450 ps
DQS output access time from CK/CK
tDQSCK -300 +300 -300 +300 -350 +350 -400 +400 ps
CK high-level width
tCH 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK
CK low-level width
tCL 0.45 0.55 0.45 0.55 0.45 0.55 0.45 0.55 tCK
CK half period
min min min min
tHP (tCL, x (tCL, x (tCL, x (tCL, x
tCH)
tCH)
tCH)
tCH)
ps 20,21
Clock cycle time, CL= x
tCK 2.0 8.0 2.2 8.0 2.5 8.0 2.86 8.0 ns 24
DQ and DM input hold time
tDH 175 x 175 x 175
x 175
x
ps
15,16,
17
DQ and DM input setup time
tDS
50
x 50
x 50
x 50
x
ps
15,16,
17
Control & Address input pulse width for
each input
tIPW 0.6 x 0.6 x 0.6 x 0.6 x tCK
DQ and DM input pulse width for each
input
tDIPW 0.35 x 0.35 x 0.35 x 0.35 x tCK
Data-out high-impedance time from CK/CK tHZ
x
tAC
max
x
tAC
max
x
tAC
max
x
tAC
max
ps
DQS low-impedance time from CK/CK
tLZ
(DQS)
tAC tAC tAC tAC tAC tAC tAC tAC
min max min max min max min max
ps
27
DQ low-impedance time from CK/CK
tLZ(DQ)
2*tAC
min
tAC
max
2*tAC
min
tAC
max
2*tAC
min
tAC
max
2*tAC
min
tAC
max
ps
27
DQS-DQ skew for DQS and associated
DQ signals
tDQSQ
x 280
x 280
x 280
x 310 ps
22
DQ hold skew factor
tQHS
x 380
x 380
x 380
x 410 ps
21
DQ/DQS output hold time from DQS
tQH
tHP -
tQHS
x
tHP -
tQHS
x
tHP -
tQHS
x
tHP -
tQHS
x
ps
Write command to first DQS latching tran-
sition
tDQSS
WL WL WL WL WL WL WL WL
-0.25 +0.25 -0.25 +0.25 -0.25 +0.25 -0.25 +0.25
tCK
DQS input high pulse width
tDQSH 0.35 x 0.35 x 0.35 x 0.35 x tCK
DQS input low pulse width
tDQSL 0.35 x 0.35 x 0.35 x 0.35 x tCK
DQS falling edge to CK setup time
tDSS 0.2
x 0.2
x 0.2
x 0.2
x tCK
DQS falling edge hold time from CK
tDSH 0.2
x 0.2
x 0.2
x 0.2
x tCK
Mode register set command cycle time
tMRD
2
x2
x2
x2
x tCK
Write postamble
tWPST 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK 19
Write preamble
tWPRE 0.35 x 0.35 x 0.35 x 0.35 x tCK
Address and control input hold time
tIH
200 x 200 x 250 x 325
x
ps
14,16,
18
Address and control input setup time
tIS
150 x 150 x 175 x 200 x
ps
14,16,
18
Read preamble
tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 0.9 1.1 tCK 28
Read postamble
tRPST 0.4 0.6 0.4 0.6 0.4 0.6 0.4 0.6 tCK 28
Active to active command period
tRRD 7.5 x 7.5 x 7.5 x 7.5 x ns 12
- 11/64 -
Rev. 1.4 Dec. 2006

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