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What is IS46LD32800A?

This electronic component, produced by the manufacturer "ISSI", performs the same function as "256Mb Mobile LPDDR2 S4 SDRAM".


IS46LD32800A Datasheet PDF - ISSI

Part Number IS46LD32800A
Description 256Mb Mobile LPDDR2 S4 SDRAM
Manufacturers ISSI 
Logo ISSI Logo 


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IS43/46LD16160A
IS43/46LD32800A
256Mb (x16, x32) Mobile LPDDR2 S4 SDRAM
FEATURES
Low-voltage Core and I/O Power Supplies
VDD2 = 1.14-1.30V, VDDCA/VDDQ = 1.14-1.30V,
VDD1 = 1.70-1.95V
High Speed Un-terminated Logic(HSUL_12) I/O
Interface
Clock Frequency Range : 10MHz to 533MHz
(data rate range : 20Mbps to 1066Mbps per I/O)
Four-bit Pre-fetch DDR Architecture
Multiplexed, double data rate, command/ad-
dress inputs
Four internal banks for concurrent operation
Bidirectional/differential data strobe per byte of
data (DQS/DQS#)
Programmable Read/Write latencies(RL/WL)
and burst lengths(4,8 or 16)
ZQ Calibration
On-chip temperature sensor to control self re-
fresh rate
Partial –array self refresh(PASR)
Deep power-down mode(DPD)
Operation Temperature
Commercial (TC = 0°C to 85°C)
Industrial (TC = -40°C to 85°C)
Automotive, A1 (TC = -40°C to 85°C)
Automotive, A2 (TC = -40°C to 105°C)
OPTIONS
Configuration:
− 16Mx16 (4M x 16 x 4 banks)
− 8Mx32 (2M x 32 x 4 banks)
Package:
− 134-ball BGA for x16 / x32
− 168-ball PoP BGA for x32
DESCRIPTION
MAY 2016
The IS43/46LD16160A/32800A is 256Mbit CMOS
LPDDR2 DRAM. The device is organized as 4 banks
of 4Meg words of 16bits or 2Meg words of 32bits.
This product uses a double-data-rate architecture to
achieve high-speed operation. The double data rate
architecture is essentially a 4N prefetch architecture
with an interface designed to transfer two data words
per clock cycle at the I/O pins. This product offers fully
synchronous operations referenced to both rising and
falling edges of the clock. The data paths are internally
pipelined and 4n bits prefetched to achieve very high
bandwidth.
ADDRESS TABLE
Parameter
Row Addresses
Column Addresses
Bank Addresses
Refresh Count
8Mx32
R0-R12
C0-C7
BA0-BA1
4096
16Mx16
R0-R12
C0-C8
BA0-BA1
4096
KEY TIMING PARAMETERS(1)
Speed
Grade
-18
Data
Rate
(Mb/s)
1066
Write Read tRCD/
Latency Latency tRP(2)
4 8 Typical
-25 800
-3 667
3
2
6 Typical
5 Typical
Notes:
1. Other clock frequencies/data rates supported; please
refer to AC timing tables.
2. Please contact ISSI for Fast trcd/trp.
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be ex-
pected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon
Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. — www.issi.com 1
Rev. A
05/02/2016

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IS46LD32800A equivalent
IS43/46LD16160A
IS43/46LD32800A
INPUT/OUTPUT FUNCTIONAL DESCRIPTION
Pad Definition and Description
Name
CK, CK#
Type
Input
CKE
Input
CS# Input
CA0 - CA9 Input
DQ0 - DQ15
(x16)
DQ0 - DQ31
(x32)
I/O
Description
Clock: CK and CK# are differential clock inputs. All Double Data Rate (DDR) CA
inputs are sampled on both positive and negative edge of CK. Single Data Rate (SDR)
inputs, CS# and CKE, are sampled at the positive Clock edge.
Clock is defined as the differential pair, CK and CK#. The positive Clock edge is
defined by the crosspoint of a rising CK and a falling CK#. The negative Clock edge is
defined by the crosspoint of a falling CK and a rising CK#.
Clock Enable: CKE HIGH activates and CKE LOW deactivates internal clock signals and
therefore device input buffers and output drivers. Power savings modes are entered and
exited through CKE transitions.
CKE is considered part of the command code. See Command Truth Table for command
code descriptions.
CKE is sampled at the positive Clock edge.
Chip Select: CS# is considered part of the command code. See Command Truth Table
for command code descriptions.
CS# is sampled at the positive Clock edge.
DDR Command/Address Inputs: Uni-directional command/address bus inputs.
CA is considered part of the command code. See Command Truth Table for command
code descriptions.
Data Inputs/Output: Bi-directional data bus
I/O Data Strobe (Bi-directional, Differential): The data strobe is bi-directional (used for
DQS0,
DQS0#,
read and write data) and differential (DQS and DQS#). It is output with read data and
input with write data. DQS is edge-aligned to read data and centered with write data.
DQS1,
DQS1#
(x16)
DQS0 -
DQS3,
DQS0# -
DQS3#
For x16, DQS0 and DQS0# correspond to the data on DQ0 - DQ7; DQS1 and
DQS1# to the data on DQ8 - DQ15.
For x32 DQS0 and DQS0# correspond to the data on DQ0 - DQ7, DQS1 and
DQS1# to the data on DQ8 - DQ15, DQS2 and DQS2# to the data on DQ16 - DQ23,
DQS3 and DQS3# to the data on DQ24 - DQ31.
(x32)
Input
DM0-DM1
(x16)
DM0 - DM3
(x32)
Input Data Mask: For LPDDR2 devices that do not support the DNV feature, DM is the
input mask signal for write data. Input data is masked when DM is sampled HIGH
coincident with that input data during a Write access. DM is sampled on both edges of
DQS. Although DM is for input only, the DM loading shall match the DQ and DQS (or
DQS#).
DM0 is the input data mask signal for the data on DQ0-7.
For x16 and x32 devices, DM1 is the input data mask signal for the data on DQ8-15.
For x32 devices, DM2 is the input data mask signal for the data on DQ16-23 and DM3 is
the input data mask signal for the data on DQ24-31.
Integrated Silicon Solution, Inc. — www.issi.com 5
Rev. A
05/02/2016


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Part NumberDescriptionMFRS
IS46LD32800AThe function is 256Mb Mobile LPDDR2 S4 SDRAM. ISSIISSI

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