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IS61WV25632ALS PDF Datasheet ( 特性, スペック, ピン接続図 )

部品番号 IS61WV25632ALS
部品説明 256K x 32 HIGH-SPEED ASYNCHRONOUS CMOS STATIC RAM
メーカ ISSI
ロゴ ISSI ロゴ 



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IS61WV25632ALS Datasheet, IS61WV25632ALS PDF,ピン配置, 機能
IS61WV25632ALL/ALS
IS61WV25632BLL/BLS
IS64WV25632BLL/BLS
256K x 32 HIGH-SPEED ASYNCHRONOUS
CMOS STATIC RAM WITH 3.3V SUPPLY
PRELIMINARY INFORMATION
APRIL 2008
FEATURES
• High-speed access times:
8, 10, 20 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with CE and OE op-
tions
CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single power supply
Vdd 1.65V to 2.2V (IS61WV25632Axx)
speed = 20ns for Vdd 1.65V to 2.2V
Vdd 2.4V to 3.6V (IS61/64WV25632Bxx)
speed = 10ns for Vdd 2.4V to 3.6V
speed = 8ns for Vdd 3.3V + 5%
• Packages available:
90-ball miniBGA (8mm x 13mm)
• Industrial and Automotive Temperature Support
• Lead-free available
DESCRIPTION
The ISSI IS61WV25632Axx/Bxx and IS64WV25632Bxx
are high-speed, 8M-bit static RAMs organized as 256K
words by 32 bits. It is fabricated using ISSI's high-per-
formance CMOS technology. This highly reliable process
coupled with innovative circuit design techniques, yields
high-performance and low power consumption devices.
When CE is HIGH (deselected), the device assumes
a standby mode at which the power dissipation can be
reduced down with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW
Write Enable (WE) controls both writing and reading of
the memory.
The device is packaged in the JEDEC standard 90-ball
BGA (8mm x 13mm).
FUNCTIONAL BLOCK DIAGRAM
A0-A17
VDD
VSS
DQa-d
DECODER
I/O
DATA
CIRCUIT
256K x 32
MEMORY ARRAY
COLUMN I/O
CE
OE
WE
BWa-d
CE2
CONTROL
CIRCUIT
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
Rev.  00B
04/23/08
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