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NZH6V2B の電気的特性と機能

NZH6V2BのメーカーはNXP Semiconductorsです、この部品の機能は「Single Zener diodes」です。


製品の詳細 ( Datasheet PDF )

部品番号 NZH6V2B
部品説明 Single Zener diodes
メーカ NXP Semiconductors
ロゴ NXP Semiconductors ロゴ 




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NZH6V2B Datasheet, NZH6V2B PDF,ピン配置, 機能
NZH series
Single Zener diodes
Rev. 01 — 27 January 2010
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
1.2 Features
„ Total power dissipation: 500 mW
„ Wide working voltage range
„ Small plastic package suitable for
surface-mounted design
„ Low differential resistance
1.3 Applications
„ General regulation functions
1.4 Quick reference data
Table 1.
Symbol
VF
Ptot
Quick reference data
Parameter
forward voltage
total power dissipation
Conditions
Min Typ Max Unit
IF = 10 mA
[1] -
-
0.9 V
Tamb 25 °C
[2] -
-
500 mW
[3] - - 1 W
[1] Pulse test: tp 300 μs; δ ≤ 0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for
cathode 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.

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NZH6V2B pdf, ピン配列
NXP Semiconductors
NZH series
Single Zener diodes
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min Max Unit
IF
Ptot
Tj
Tamb
Tstg
forward current
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb 25 °C
-
[1] -
[2] -
-
55
65
250
500
1
150
+150
+150
mA
mW
W
°C
°C
°C
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
Rth(j-sp)
thermal resistance from
junction to solder point
Min Typ Max Unit
[1] - - 250 K/W
[2] - - 125 K/W
[3] - - 70 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[2] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[3] Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics
Tj = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
VF
forward voltage
IF = 10 mA
[1] Pulse test: tp 300 μs; δ ≤ 0.02.
Min Typ Max Unit
[1] - - 0.9 V
Table 8. Characteristics per type; NZH3V0B to NZH10C
Tj = 25 °C unless otherwise specified.
NZHxxx
Working voltage Maximum differential Reverse current
VZ (V);
IZ = 20 mA
resistance
rdif (Ω)
IR (μA)
Min
Max
IZ = 1 mA IZ = 20 mA Max
VR (V)
3V0B
2.85 3.15 1000
80
50 1
3V3A
3.16 3.38 1000
70
20 1
3V6B
3.42 3.78 1000
60
5
1
3V9B
3.71 4.10 1000
50
5
1
Diode
capacitance
Cd (pF)[1]
Max
450
450
450
450
NZH_SER_1
Product data sheet
Rev. 01 — 27 January 2010
© NXP B.V. 2010. All rights reserved.
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3Pages


NZH6V2B 電子部品, 半導体
NXP Semiconductors
8. Package outline
NZH series
Single Zener diodes
3.6 2.7
3.4 2.5
1.7
1.5
1
1.2
1.0
0.55
0.35
Dimensions in mm
Fig 4. Package outline SOD123F
2
0.70
0.55
0.25
0.10
04-11-29
9. Packing information
Table 11. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
NZH3V0B to SOD123F 4 mm pitch, 8 mm tape and reel
NZH30C[2]
Packing quantity
3 000
10 000
-115 -135
[1] For further information and the availability of packing methods, see Section 13.
[2] The series consists of 25 types with nominal working voltages from 3.0 V to 30 V.
10. Soldering
4.4
4
2.9
1.6
2.1 1.6
1.1 1.2
NZH_SER_1
Product data sheet
1.1
(2×)
Fig 5.
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD123F
Rev. 01 — 27 January 2010
solder lands
solder resist
solder paste
occupied area
© NXP B.V. 2010. All rights reserved.
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部品番号部品説明メーカ
NZH6V2B

Single Zener diodes

NXP Semiconductors
NXP Semiconductors


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