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RT9737 の電気的特性と機能

RT9737のメーカーはRichtekです、この部品の機能は「5V Capable Low-Voltage DPDT Analog Switch」です。


製品の詳細 ( Datasheet PDF )

部品番号 RT9737
部品説明 5V Capable Low-Voltage DPDT Analog Switch
メーカ Richtek
ロゴ Richtek ロゴ 




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RT9737 Datasheet, RT9737 PDF,ピン配置, 機能
RT9737
5V Capable Low-Voltage DPDT Analog Switch
General Description
RT9737 is a 5V high quality low-voltage double-pole
double-throw (DPDT) analog switch. RT9737 supply
voltage is designed to operate from 2.5V to 5.5V.
Supply voltage can be smaller than input voltage while
keeping 5V input range. With 70mturn-on resistance,
power-loss and signal distortion can be minimized.
RT9737 is ideal for switching audio signal from outputs
of audio amplifiers. The break-before-make feature
prevents signal distortion during the transferring of a
signal from one path to another for audio applications.
Ordering Information
RT9737
Package Type
WSC : WL-CSP-9B 1.24x1.24 (BSC)
Note :
Richtek products are :
RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes
Marking Information
Features
Maximum Input Signal Range 0 to 5.5V
70mTurn-On Resistance
2.5V to 5.5V Supply Voltage
40A Quiescent Current
Break-Before-Make Between Channel Transition
Available in 9Ball WL-CSP Package
Applications
Smartphone
Tablet
Pin Configurations
(TOP VIEW)
INA1 A1 A2 A3 INB1
OUTA B1 B2 B3 OUTB
GND
INA2 C1 C2 C3 INB2
WL-CSP-9B 1.24x1.24 (BSC)
1PW
1P : Product Code
W : Date Code
Simplified Application Circuit
Audio
Amplifier 1
Audio
Amplifier 2
SEL
RT9737
INA1
INB1
INA2
INB2
SEL
OUTA
OUTB
VDDEN
GND
Audio
Connector
CVDDEN
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS9737-00 February 2014
is a registered trademark of Richtek Technology Corporation
www.richtek.com
1

1 Page





RT9737 pdf, ピン配列
RT9737
Absolute Maximum Ratings (Note 1)
VDDEN, INA1, INA2, INB1, INB2, OUTA, OUTB, SEL------------------------------------------------- 0.3 to 6V
Power Dissipation, PD @ TA = 25C
WL-CSP-9B 1.24x1.24 (BSC)-------------------------------------------------------------------------------- 1.28W
Package Thermal Resistance (Note 2)
WL-CSP-9B 1.24x1.24 (BSC), JA ------------------------------------------------------------------------ 78.1°C/W
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------- 260C
Junction Temperature ----------------------------------------------------------------------------------------- 150C
Storage Temperature Range -------------------------------------------------------------------------------- 65C to 150C
ESD Susceptibility (Note 3)
HBM (Human Body Model) ----------------------------------------------------------------------------------- 2kV
MM (Machine Model)------------------------------------------------------------------------------------------- 200V
Recommended Operating Conditions (Note 4)
Supply Input Voltage, VDDEN-------------------------------------------------------------------------------- 2.5V to 5.5V
Junction Temperature Range--------------------------------------------------------------------------------- 40C to 125C
Ambient Temperature Range --------------------------------------------------------------------------------- 40C to 85C
Electrical Characteristics
(VDDEN = 2.5V, CVDDEN = 0.1μF, TA= 25C, for each LDO unless otherwise specified)
Parameter
Symbol
Test Conditions
Min Typ Max Unit
Power Supply
Power Supply Range
VDDEN
2.5 -- 5.5 V
Power Supply Rejection Ratio PSRR Vp-p = 200mV, f = 20kHz, RL = 32(Note 5) -- 80 -- dB
Quiescent Current
IQ VDDEN = 2.5V to 5.5V
-- 40 60 A
Analog Switch
Input Signal Range
0 -- 5.5 V
Turn-On Resistance
Off-State Leakage Current
RDS(ON)
VDDEN = 2.5V, OUT = 0V, IOUT =100mA
VDDEN = 3.6V, OUT = 0V, IOUT= 100mA
INA, INB, OUTA, OUTB, VDDEN = 5.5V
INA, INB, OUTA, OUTB = 5.5V, VDDEN = 0V
-- 90 125 m
-- 70 100 m
-- 1.2 1.5 A
0.12 0.2 A
Turn-On Time
Turn-Off Time
Break-Before-Make Time
Off-Isolation (Note 5)
tON
tOFF
tBBM
Crosstalk (Note 5)
THD+N (Note 5)
-3dB Bandwidth (Note 5)
INA/INB Capacitance
OUTA/OUTB Capacitance
INA, INB = 0V
-- 5 10 ms
INA, INB = 0V (Note 5)
-- -- 100 s
INA, INB = 0V
-- 5 10
VDDEN = 0V, RL = 50, INA/INB = 0.5Vpp,
20kHz
--
50
--
RL = 50, INA/INB = 0.5Vpp, 20kHz
-- 80 --
RL = 50, INA/INB = 0.5Vpp, 1kHz, DC bias =
0.25V
--
0.001
--
ms
dB
dB
%
RL = 50
-- 2 -- MHz
INA /INB = 0.5VP-P, f = 1MHz (Note 5)
-- 70 -- pF
INA /INB = 0.5VP-P, f = 1MHz (Note 5)
-- 120 -- pF
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
DS9737-00 February 2014
is a registered trademark of Richtek Technology Corporation
www.richtek.com
3


3Pages


RT9737 電子部品, 半導体
RT9737
Application Information
RT9737 is a 5V high quality low-voltage double-pole
double-throw (DPDT) analog switch. RT9737 supply
voltage is designed to operate from 2.5 to 5.5V. Supply
voltage can be smaller than input voltage while keeping
5V input range. With 70mturn-on resistance, power-
loss and signal distortion can be minimized. RT9737 is
ideal for switching audio signal from outputs of audio
amplifiers. The break-before-make feature prevents
signal distortion during the transferring of a signal from
one path to another for audio applications.
Analog Input
RT9737 internal topology design for input and output
voltage level can greater than supply voltage.
Low turn-on resistance and excellent channel to
channel matching are ideal for audio applications.
Switch Logic Control
RT9737 can use SEL pin to control internal switches
position for another audio source application. SEL pin
input current is very low.
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature.
The maximum power dissipation can be calculated by
the following formula :
PD(MAX) = (TJ(MAX) TA) / JA
where TJ(MAX) is the maximum junction temperature,
TA is the ambient temperature, and JA is the junction to
ambient thermal resistance.
For recommended operating condition specifications,
the maximum junction temperature is 125C. The
junction to ambient thermal resistance, JA, is layout
dependent. For WL-CSP-9B 1.24x1.24 (BSC)
packages, the thermal resistance, JA, is 78.1C/W on
a standard JEDEC 51-7 four-layer thermal test board.
The maximum power dissipation at TA = 25C can be
calculated by the following formula :
PD(MAX) = (125C 25C) / (78.1C/W) = 1.28W for
WL-CSP-9B 1.24x1.24 (BSC) package
The maximum power dissipation depends on the
operating ambient temperature for fixed TJ(MAX) and
thermal resistance, JA. The derating curve in Figure 1
allows the designer to see the effect of rising ambient
temperature on the maximum power dissipation.
Four-Layer PCB
Figure 1. Derating Curve of Maximum Power
Dissipation
INA1
OUTA
INA2
A1 A2 A3
B1 B2 B3
GND
C1 C2 C3
INB1
OUTB
INB2
Use blind hole to
connect other strong
ground plane.
GND
CVDDEN
Place the capacitor CVDDEN as
close as possible to the VDDEN.
Figure 2. PCB Layout Guide
Copyright © 2014 Richtek Technology Corporation. All rights reserved.
www.richtek.com
6
is a registered trademark of Richtek Technology Corporation
DS9737-00 February 2014

6 Page



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共有リンク

Link :


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