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PDF RT9059A Data sheet ( Hoja de datos )

Número de pieza RT9059A
Descripción Ultra-Low Dropout Voltage Regulator
Fabricantes Richtek 
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®
RT9059A
3A, Ultra-Low Dropout Voltage Regulator
General Description
The RT9059A is a high performance positive voltage
regulator designed for use in applications requiring very
low input voltage and very low dropout voltage at up to 3A.
It operates with a VIN as low as 1V and VDD voltage 3V
with programmable output voltage as low as 0.8V. The
RT9059A features ultra-low dropout, ideal for applications
where VOUT is very close to VIN. Additionally, it has an
enable pin to further reduce power dissipation while
shutdown. The RT9059A provides excellent regulation over
variations in line, load and temperature. The RT9059A
provides a power good signal to indicate if the voltage
level of VO reaches 90% of its rating value.
Ordering Information
RT9059A
Package Type
QW : WDFN-10L 3x3 (W-Type)
Lead Plating System
G : Green (Halogen Free and Pb Free)
Note :
Richtek products are :
RoHS compliant and compatible with the current require-
ments of IPC/JEDEC J-STD-020.
Suitable for use in SnPb or Pb-free soldering processes.
Features
Output Current up to 3A
High Accuracy ADJ Voltage 1.5%
Dropout Voltage 350mV @ 3A Typically
VOUT Power Good Signal
VOUT Pull Low Resistance when Disable
Current Limit Protection
Thermal Shutdown Protection
RoHS Compliant and Halogen Free
Applications
Notebook PC Applications
Motherboard Applications
Marking Information
4S= : Product Code
4S=YM
DNN
YMDNN : Date Code
Pin Configurations
(TOP VIEW)
VOUT 1
VOUT 2
VOUT 3
ADJ 4
PGOOD 5
10 VDD
9 VIN
8 VIN
7 VIN
11 6 EN
WDFN-10L 3x3
Simplified Application Circuit
Enable
RT9059A
EN PGOOD
VDD
CVDD
VOUT
VIN ADJ
CIN GND
RPGOOD
R1 COUT
R2
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS9059A-01 October 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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RT9059A pdf
RT9059A
Parameter
Fixed Output Voltage
Accuracy
VOUT Load Regulation
OUT Line Regulation
Symbol
VLOAD
VLINE
Dropout Voltage
VDROP
Current Limit
ILIM
Short Circuit Current
ISC
VOUT Pull Low Resistance RPULL
Thermal Shutdown
Temperature
TSD
Thermal Shutdown Recovery
Temperature
TSDR
Test Conditions
Min Typ Max Unit
1.5 -- 1.5 %
IOUT = 1mA to 3A,
VIN = VOUT + 1V
VDD = 3.6V to 5.5V,
VIN = VOUT + 1V to 5V, IOUT = 1mA
--
--
0.5 1
0.2 0.6
%
%
IOUT = 2A
IOUT = 3A
-- 250 350
mV
-- 350 450
VIN = 3.6V
3.1 3.6 4.2 A
VOUT < 0.2V
1 1.4 1.8 A
VEN = 0V
-- 150 --
-- 160 --
ºC
-- 90 -- ºC
PGOOD Rising Threshold
PGOOD Hysteresis
PGOOD Delay Time
PGOOD Sink Capability
EN Input
Voltage
Logic-High
Logic-Low
EN Delay Time
VTH_PGOOD VOUT Rising
VTH_PGOOD VOUT Falling
VPGOOD
ISINK = 10mA
VIH
VIL
-- 90 --
-- 10 --
-- 1 1.5
-- 0.2 0.4
1.2 --
--
-- -- 0.4
0.3 0.85 1.4
%
%
ms
V
V
ms
EN Pin Bias Current
VDD Pin Shutdown Current
VIN Pin Shutdown Current
Inrush Current
Soft-Start Time
IEN
ISHDN_VDD
ISHDN_VIN
IINRUSH
tSS
VEN = 0V
VEN = 0V
VEN = 0V, VIN = 5V
VOUT = 1.8V, COUT = 10F,
ILoad = 1A
-- 12 -- A
-- 15 30 A
-- -- 1 A
-- 0.5 --
A
1.9 2.8 3.75 ms
Note 1. Stresses beyond those listed Absolute Maximum Ratingsmay cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the exposed pad of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS9059A-01 October 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
5

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RT9059A arduino
Thermal Considerations
For continuous operation, do not exceed absolute
maximum junction temperature. The maximum power
dissipation depends on the thermal resistance of the IC
package, PCB layout, rate of surrounding airflow, and
difference between junction and ambient temperature. The
maximum power dissipation can be calculated by the
following formula :
PD(MAX) = (TJ(MAX) TA) / θJA
where TJ(MAX) is the maximum junction temperature, TAis
the ambient temperature, and θJA is the junction to ambient
thermal resistance.
For recommended operating condition specifications, the
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
WDFN-10L 3x3 package, the thermal resistance, θJA, is
30.5°C/W on a standard JEDEC 51-7 four-layer thermal
test board. The maximum power dissipation at TA = 25°C
can be calculated by the following formula :
PD(MAX) = (125°C 25°C) / (30.5°C/W) = 3.27W for
WDFN-10L 3x3 package
The maximum power dissipation depends on the operating
ambient temperature for fixed TJ(MAX) and thermal
resistance, θJA. The derating curve in Figure 3 allows the
designer to see the effect of rising ambient temperature
on the maximum power dissipation.
3.5
Four-Layer PCB
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
25 50 75 100
Ambient Temperature (°C)
125
Figure 3. Derating Curve of Maximum Power Dissipation
RT9059A
Copyright ©2013 Richtek Technology Corporation. All rights reserved.
DS9059A-01 October 2013
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
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