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PDF BYW53 Data sheet ( Hoja de datos )

Número de pieza BYW53
Descripción Silicon Mesa Rectifiers
Fabricantes TEMIC 
Logotipo TEMIC Logotipo



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Silicon Mesa Rectifiers
BYW52...BYW56
Features
D Controlled avalanche characteristics
D Glass passivated junction
D Hermetically sealed package
D Low reverse current
D High surge current loading
D Electrically equivalent diodes:
BYW52 – 1N5059 BYW53 – 1N5060
BYW54 – 1N5061 BYW55 – 1N5062
Applications
Rectifier, general purpose
94 9539
Absolute Maximum Ratings
Tj = 25_C
Parameter
Test Conditions
Reverse voltage, repetitive peak
reverse voltage
Peak forward surge current
Repetitive peak forward current
Average forward current
Pulse avalanche peak power
Max. pulse energy in the
avalanche mode, non repetitive
(inductive load switch off)
i2* t–rating
Junction temperature
Storage temperature range
tp=10ms
ϕ=180°
tp=20ms half sinus
wave, Tj=175°C
I(BR)R=1A, Tj=175°C
Type
BYW52
BYW53
BYW54
BYW55
BYW56
Symbol
VR=VRRM
VR=VRRM
VR=VRRM
VR=VRRM
VR=VRRM
IFSM
IFRM
IFAV
PR
ER
Value
200
400
600
800
1000
50
12
2
1000
20
Unit
V
V
V
V
V
A
A
A
W
mWs
i2*t 8 A2*s
Tj 175 °C
Tstg –55...+175 °C
Maximum Thermal Resistance
Tj = 25_C
Parameter
Junction ambient
Test Conditions
l=10mm, TL=constant
on PC board with spacing 25mm
Symbol
RthJA
RthJA
Value
45
100
Unit
K/W
K/W
TELEFUNKEN Semiconductors
Rev. A1, 12-Dec-94
1 (5)

1 page




BYW53 pdf
BYW52...BYW56
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of
continuous improvements to eliminate the use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain
such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423
TELEFUNKEN Semiconductors
Rev. A1, 12-Dec-94
5 (5)

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