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GL865 の電気的特性と機能
GL865のメーカーはTelitです、この部品の機能は「Hardware User Guide」です。 |
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製品の詳細 ( Datasheet PDF )
部品番号 GL865 |
部品説明 Hardware User Guide |
メーカ Telit |
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このページの下部にプレビューとGL865ダウンロード(pdfファイル)リンクがあります。 Total 30 pages |

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GL865 Hardware User Guide
1vv0300910 Rev.8 – 2015-05-25
1 Page


GL865 Hardware User Guide
1vv0300910 Rev.8 – 2015-05-25
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in
the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs
contained in the Telit products described in this instruction manual may not be copied (reverse
engineered) or reproduced in any manner without the express written permission of Telit or the
3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant
either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal
non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 3 of 78
3Pages


GL865 Hardware User Guide
1vv0300910 Rev.8 – 2015-05-25
10.1.1. Input Lines.....................................................................................................................................................51
10.1.2. Output Lines ..................................................................................................................................................52
11. GENERAL PURPOSE I/O ......................................................................................................................................53
11.1. GPIO LOGIC LEVELS...............................................................................................................................................54
11.2. USING A GPIO PAD AS INPUT ...............................................................................................................................55
11.3. USING A GPIO PAD AS OUTPUT ...........................................................................................................................55
11.4. USING THE RF TRANSMISSION CONTROL GPIO4....................................................................................................55
11.5. USING THE RFTXMON OUTPUT GPIO5 ................................................................................................................55
11.6. USING THE ALARM OUTPUT GPIO6........................................................................................................................56
11.7. USING THE BUZZER OUTPUT GPIO7.......................................................................................................................56
11.8. MAGNETIC BUZZER CONCEPTS...............................................................................................................................57
11.8.1. Short Description...........................................................................................................................................57
11.8.2. Frequency Behaviour ....................................................................................................................................57
11.8.3. Power Supply Influence.................................................................................................................................58
11.8.4. Working Current Influence............................................................................................................................58
11.9. STAT LED INDICATION OF NETWORK SERVICE AVAILABILITY...............................................................................59
11.10. SIMIN DETECT FUNCTION ..................................................................................................................................60
11.11. RTC BYPASS OUT...............................................................................................................................................61
11.12. SIM HOLDER IMPLEMENTATION ........................................................................................................................61
12. DAC AND ADC SECTION .....................................................................................................................................62
12.1. DAC CONVERTER...................................................................................................................................................62
12.1.1. Description ....................................................................................................................................................62
12.1.2. Enabling DAC ...............................................................................................................................................63
12.1.3. Low Pass Filter Example...............................................................................................................................63
12.2. ADC CONVERTER...................................................................................................................................................64
12.2.1. Description ....................................................................................................................................................64
12.2.2. Using ADC Converter ...................................................................................................................................64
12.3. DEBUG OF THE GL865 IN PRODUCTION...................................................................................................................65
13. MOUNTING THE GL865 ON YOUR BOARD ....................................................................................................66
13.1. GENERAL ................................................................................................................................................................66
13.2. MODULE FINISHING & DIMENSIONS ........................................................................................................................66
13.3. RECOMMENDED FOOT PRINT FOR THE APPLICATION................................................................................................67
13.4. STENCIL ..................................................................................................................................................................68
13.5. PCB PAD DESIGN ....................................................................................................................................................68
13.6. RECOMMENDATIONS FOR PCB PAD DIMENSIONS (MM)...........................................................................................68
13.7. SOLDER PASTE ........................................................................................................................................................69
13.7.1. GL865 Solder reflow .....................................................................................................................................70
14. PACKING SYSTEM ................................................................................................................................................71
14.1. PACKING ON TRAY ..................................................................................................................................................71
14.2. PACKING ON REEL ..................................................................................................................................................73
14.2.1. Carrier tape detail.........................................................................................................................................74
14.2.2. Carrier tape detail.........................................................................................................................................74
14.3. MOISTURE SENSIBILITY...........................................................................................................................................75
15. CONFORMITY ASSESSMENT ISSUES ..............................................................................................................76
16. SAFETY RECOMMANDATIONS.........................................................................................................................77
17. DOCUMENT HISTORY .........................................................................................................................................78
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 6 of 78
6 Page
合計 : 30 ページ |
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