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IS45S32400B の電気的特性と機能
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IS45S32400BのメーカーはISSIです、この部品の機能は「128-MBIT SYNCHRONOUS DRAM」です。 |
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製品の詳細 ( Datasheet PDF )
| 部品番号 IS45S32400B |
| 部品説明 128-MBIT SYNCHRONOUS DRAM |
| メーカ ISSI |
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IS45S32400B
4Meg x 32
128-MBIT SYNCHRONOUS DRAM
ISSI®
JULY 2006
FEATURES
• Clock frequency: 166, 143, 125, 100 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
IS45S32400B
VDD VDDQ
3.3V 3.3V
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh with programmable refresh periods
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Automotive Temperature Range
Option A: 0oC to +70oC
Option A1: -40oC to +85oC
• Available in 86-pin TSOP-II and 90-ball FBGA
• Available in Lead-free
OVERVIEW
ISSI's 128Mb Synchronous DRAM achieves high-speed
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock
input.The 128Mb SDRAM is organized in 1Meg x 32 bit x 4
Banks.
KEY TIMING PARAMETERS
Parameter
Clk Cycle Time
CAS Latency = 3
CAS Latency = 2
Clk Frequency
CAS Latency = 3
CAS Latency = 2
Access Time from Clock
CAS Latency = 3
CAS Latency = 2
-6 -7
67
8 10
166 143
125 100
5.4 5.4
6.5 6.5
Unit
ns
ns
Mhz
Mhz
ns
ns
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
07/10/06
1
1 Page
IS45S32400B
ISSI ®
PIN CONFIGURATIONS
86 pin TSOP - Type II for x32
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
NC
VDD
DQM0
WE
CAS
RAS
CS
A11
BA0
BA1
A10
A0
A1
A2
DQM2
VDD
NC
DQ16
VSSQ
DQ17
DQ18
VDDQ
DQ19
DQ20
VSSQ
DQ21
DQ22
VDDQ
DQ23
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
86 VSS
85 DQ15
84 VSSQ
83 DQ14
82 DQ13
81 VDDQ
80 DQ12
79 DQ11
78 VSSQ
77 DQ10
76 DQ9
75 VDDQ
74 DQ8
73 NC
72 VSS
71 DQM1
70 NC
69 NC
68 CLK
67 CKE
66 A9
65 A8
64 A7
63 A6
62 A5
61 A4
60 A3
59 DQM3
58 VSS
57 NC
56 DQ31
55 VDDQ
54 DQ30
53 DQ29
52 VSSQ
51 DQ28
50 DQ27
49 VDDQ
48 DQ26
47 DQ25
46 VSSQ
45 DQ24
44 VSS
PIN DESCRIPTIONS
A0-A11
A0-A7
BA0, BA1
DQ0 to DQ31
CLK
CKE
CS
RAS
CAS
Row Address Input
Column Address Input
Bank Select Address
Data I/O
System Clock Input
Clock Enable
Chip Select
Row Address Strobe Command
Column Address Strobe Command
WE
DQM0-DQM3
VDD
Vss
VDDQ
VssQ
NC
Write Enable
x32 Input/Output Mask
Power
Ground
Power Supply for I/O Pin
Ground for I/O Pin
No Connection
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
07/10/06
3
3Pages
IS45S32400B
ISSI ®
GENERAL DESCRIPTION
READ
The READ command selects the bank from BA0, BA1
inputs and starts a burst read access to an active row.
Inputs A0-A7 provides the starting column location. When
A10 is HIGH, this command functions as an AUTO
PRECHARGE command. When the auto precharge is
selected, the row being accessed will be precharged at the
end of the READ burst. The row will remain open for
subsequent accesses when AUTO PRECHARGE is not
selected. DQ’s read data is subject to the logic level on the
DQM inputs two clocks earlier. When a given DQM signal
was registered HIGH, the corresponding DQ’s will be High-
Z two clocks later. DQ’s will provide valid data when the
DQM signal was registered LOW.
WRITE
A burst write access to an active row is initiated with the
WRITE command. BA0, BA1 inputs selects the bank, and
the starting column location is provided by inputs A0-A7.
Whether or not AUTO-PRECHARGE is used is determined
by A10.
The row being accessed will be precharged at the end of the
WRITE burst, if AUTO PRECHARGE is selected. If AUTO
PRECHARGE is not selected, the row will remain open for
subsequent accesses.
A memory array is written with corresponding input data on
DQ’s and DQM input logic level appearing at the same time.
Data will be written to memory when DQM signal is LOW.
When DQM is HIGH, the corresponding data inputs will be
ignored, and a WRITE will not be executed to that byte/
column location.
PRECHARGE
The PRECHARGE command is used to deactivate the open
row in a particular bank or the open row in all banks. BA0,
BA1 can be used to select which bank is precharged or they
are treated as “Don’t Care”. A10 determined whether one or
all banks are precharged. After executing this command,
the next command for the selected bank(s) is executed after
passage of the period t , which is the period required for
RP
bank precharging. Once a bank has been precharged, it is
in the idle state and must be activated prior to any READ or
WRITE commands being issued to that bank.
AUTO PRECHARGE
The AUTO PRECHARGE function ensures that the precharge
is initiated at the earliest valid stage within a burst. This
function allows for individual-bank precharge without requir-
ing an explicit command. A10 to enable the AUTO
PRECHARGE function in conjunction with a specific READ
or WRITE command. For each individual READ or WRITE
command, auto precharge is either enabled or disabled.
AUTO PRECHARGE does not apply except in full-page
burst mode. Upon completion of the READ or WRITE burst,
a precharge of the bank/row that is addressed is automati-
cally performed.
AUTO REFRESH COMMAND
This command executes the AUTO REFRESH operation.
The row address and bank to be refreshed are automatically
generatedduringthisoperation. Thestipulatedperiod(tRC)is
required for a single refresh operation, and no other com-
mands can be executed during this period. This command is
executed at least 4096 times for every 64ms. During an
AUTO REFRESH command, address bits are “Don’t Care”.
This command corresponds to CBR Auto-refresh.
BURST TERMINATE
The BURST TERMINATE command forcibly terminates the
burst read and write operations by truncating either fixed-
length or full-page bursts and the most recently registered
READ or WRITE command prior to the BURST TERMI-
NATE.
COMMAND INHIBIT
COMMAND INHIBIT prevents new commands from being
executed. Operations in progress are not affected, apart
from whether the CLK signal is enabled
NO OPERATION
When CS is low, the NOP command prevents unwanted
commands from being registered during idle or wait states.
LOAD MODE REGISTER
During the LOAD MODE REGISTER command the mode
register is loaded from A0-A11. This command can only be
issued when all banks are idle.
ACTIVE COMMAND
When the ACTIVE COMMAND is activated, BA0, BA1
inputs selects a bank to be accessed, and the address
inputs on A0-A11 selects the row. Until a PRECHARGE
command is issued to the bank, the row remains open for
accesses.
6 Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
07/10/06
6 Page
合計 : 30 ページ |
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| 部品番号 | 部品説明 | メーカ |
| IS45S32400B | 128-MBIT SYNCHRONOUS DRAM | ISSI |
| IS45S32400E | 128Mb SYNCHRONOUS DRAM | ISSI |