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MSB709-RT1 の電気的特性と機能
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MSB709-RT1のメーカーはMotorola Semiconductor Productsです、この部品の機能は「Small Signal Plastic Pnp」です。 |
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製品の詳細 ( Datasheet PDF )
| 部品番号 MSB709-RT1 |
| 部品説明 Small Signal Plastic Pnp |
| メーカ Motorola Semiconductor Products |
ロゴ |
このページの下部にプレビューとMSB709-RT1ダウンロード（pdfファイル）リンクがあります。 Total 4 pages |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MSB709–RT1/D
PNP General Purpose Amplifier
Transistor Surface Mount
COLLECTOR
3
MSB709-RT1
Motorola Preferred Device
MAXIMUM RATINGS (TA = 25°C)
Rating
Symbol
Collector–Base Voltage
V(BR)CBO
Collector–Emitter Voltage
V(BR)CEO
Emitter–Base Voltage
V(BR)EBO
Collector Current — Continuous
IC
Collector Current — Peak
IC(P)
THERMAL CHARACTERISTICS
Characteristic
Symbol
Power Dissipation
PD
Junction Temperature
TJ
Storage Temperature
Tstg
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Collector–Emitter Breakdown Voltage (IC = – 2.0 mAdc, IB = 0)
Collector–Base Breakdown Voltage (IC = –10 µAdc, IE = 0)
www.DataSEhmeeittte4rU–.Bcaosme Breakdown Voltage (IE = –10 µAdc, IE = 0)
Collector–Base Cutoff Current (VCB = –45 Vdc, IE = 0)
Collector–Emitter Cutoff Current (VCE = –10 Vdc, IB = 0)
DC Current Gain(1)
(VCE = –10 Vdc, IC = – 2.0 mAdc)
Collector–Emitter Saturation Voltage
(IC = –100 mAdc, IB = –10 mAdc)
1. Pulse Test: Pulse Width ≤ 300 µs, D.C. ≤ 2%.
2
BASE
Value
– 60
– 45
– 7.0
–100
– 200
1
EMITTER
Unit
Vdc
Vdc
Vdc
mAdc
mAdc
Max
200
150
– 55 ~ +150
Unit
mW
°C
°C
Symbol
V(BR)CEO
V(BR)CBO
V(BR)EBO
ICBO
ICEO
hFE1
VCE(sat)
DEVICE MARKING
2
1
3
CASE 318D–03, STYLE 1
SC–59
Min
– 45
– 60
– 7.0
—
—
210
—
Max
—
—
—
– 0.1
–100
340
– 0.5
Unit
Vdc
Vdc
Vdc
µAdc
nAdc
—
Vdc
Marking Symbol
ARX
The “X” represents a smaller alpha digit Date Code. The Date Code indicates the actual month
in which the part was manufactured.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 3
Motorola Small–Signal Transistors, FETs and Diodes Device Data
© Motorola, Inc. 1996
1
1 Page
MSB709-RT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the SC–59 package should be
the same as the pad size on the printed circuit board, i.e., a
1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of control
settings that will give the desired heat pattern. The operator
must set temperatures for several heating zones, and a
figure for belt speed. Taken together, these control settings
make up a heating “profile” for that particular circuit board.
On machines controlled by a computer, the computer
remembers these profiles from one operating session to the
next. Figure 1 shows a typical heating profile for use when
soldering a surface mount device to a printed circuit board.
This profile will vary among soldering systems but it is a good
starting point. Factors that can affect the profile include the
type of soldering system in use, density and types of
components on the board, type of solder used, and the type
of board or substrate material being used. This profile shows
temperature versus time. The line on the graph shows the
actual temperature that might be experienced on the surface
of a test board at or near a central solder joint. The two
profiles are based on a high density and a low density board.
The Vitronics SMD310 convection/infrared reflow soldering
system was used to generate this profile. The type of solder
used was 62/36/2 Tin Lead Silver with a melting point
between 177 –189°C. When this type of furnace is used for
solder reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
www.DataSheet4U.com
200°C
STEP 1 STEP 2 STEP 3
STEP 4
STEP 5 STEP 6 STEP 7
PREHEAT VENT HEATING
HEATING HEATING VENT COOLING
ZONE 1
“RAMP”
“SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7
“RAMP”
“SOAK”
“SPIKE”
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
205° TO 219°C
PEAK AT
SOLDER JOINT
150°C
150°C
100°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 1. Typical Solder Heating Profile
Motorola Small–Signal Transistors, FETs and Diodes Device Data
3
3Pages
合計 : 4 ページ |
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データシートを活用すると、その部品の主な機能と仕様を詳しく理解できます。 ピン構成、電気的特性、動作パラメータ、性能を確認してください。 |
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| 部品番号 | 部品説明 | メーカ |
| MSB709-RT1 | PNP General Purpose Amplifier Transistor Surface Mount |  LRC |
| MSB709-RT1 | Small Signal Plastic Pnp |  ON Semiconductor |
| MSB709-RT1 | Small Signal Plastic Pnp | Motorola Semiconductor Products |