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LG80030 の電気的特性と機能
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LG80030のメーカーはJiangsu Wenrun Optoelectronicです、この部品の機能は「LED」です。 |
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製品の詳細 ( Datasheet PDF )
| 部品番号 LG80030 |
| 部品説明 LED |
| メーカ Jiangsu Wenrun Optoelectronic |
ロゴ |
このページの下部にプレビューとLG80030ダウンロード（pdfファイル）リンクがあります。 Total 6 pages |
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www.DataSheet4U.com
SPECIFICATIONS FOR STANDARD
LED LAMPS
L 800
Series
WENRUN OPTOELECTRONIC
1 Page
www.DataSheet4U.com
Package Dimensions:
WENRUN LED Lamps L 800 Series
2.54
typ
1.5
max
0.5
typ
1.0min
25.0min
2.0
9.0
7.8
1
2
9.2
1.ANODE
2.CATHODE
NOTES
1 All dimensions are in millimetres (mm).
2 Tolerance is 0.25mm(0.01”) unless otherwise noted.
3 Protruded resin under flange is 1.5mm Max LED.
Absolute Maximum Rating Ta=25
Parameter
Symbol Green
Power Dissipation
Pd
Pulse Forward Current
(Duty 1/10 @ 1kHz)
IFP
Continuous Forward Current
IF
Reverse Voltage
VR
Operating Temperature Range
Topr
Storage Temperature Range
Tstg
Soldering Temperature
Tsol
Notes Soldering time 5 seconds.
60
70
20
5
Yellow Super Red Orange Unit
60 50 60 mW
70 70 70 mA
20 20
55
-30 +85
-40 +100
260 5
20 mA
5V
Prepared date June 2005
http://www.wenrun.com
Rev. 3
Page 2of 5
3Pages
www.DataSheet4U.com
Label Form Specification
WENRUN LED Lamps L 800 Series
WENRUN OPTO.
TYPE Lxxxxxx
QUTY xxxxPCS
CODE xxxxxxxx
DATE xxxxxx
Manufacturer
Part No.
Quantity
Classing Code
Sealing Date (year-month-day)
Precautions In Use
A Soldering Conditions
1 When soldering, leave the minimum clearance between the bottom of the resin and the soldering point.
2 Maximum allowable soldering conditions are.
Solder dipping: 260 max., 5 seconds max., one time.
Soldering iron: 350 max., 5 seconds max., one time.
3 Contact between molten solder and the resin must be avoided.
4 In soldering, do not put any stress on the lead frame, particularly when heated.
B Lead frame Forming and Use
1 When forming leads ,the leads should be bent at a point at least 3mm from the base of epoxy. Lead
forming should be done before soldering.
2 Do not apply any bending stress to the base of the lead. The stress to the base may damage the LEDs
characteristics.
3 When mounting the LEDs onto a printed circuit board ,the holes on the circuit board should be exactly
aligned with the leads of the LEDs.
4 Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or
discoloration may cause difficulty during soldering operations. It is recommended that the LEDs be used as
soon as possible.
5 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments.
Notes:
1 Above specification may be changed without notice. We will reserve authority on material change for
above specification.
2 When using this product, please observe the absolute maximum ratings and the instructions for the
specification sheets. We assume no responsibility for any damage resulting from use of the product which
does not comply with the instructions included in the specification sheets.
Prepared date June 2005
http://www.wenrun.com
Rev. 3
Page 5of 5
6 Page
合計 : 6 ページ |
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| 部品番号 | 部品説明 | メーカ |
| LG80030 | LED | Jiangsu Wenrun Optoelectronic |