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ADP1614 の電気的特性と機能

ADP1614のメーカーはAnalog Devicesです、この部品の機能は「DC-to-DC Switching Converter」です。


製品の詳細 ( Datasheet PDF )

部品番号
ADP1614
部品説明
DC-to-DC Switching Converter
メーカ
Analog Devices
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Analog Devices ロゴ 




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ADP1614 Datasheet, ADP1614 PDF,ピン配置, 機能
Data Sheet
650 kHz/1.3 MHz, 4 A, Step-Up,
PWM, DC-to-DC Switching Converter
ADP1614
FEATURES
Adjustable and fixed current-limit options
Adjustable up to 4 A
Fixed 3 A
2.5 V to 5.5 V input voltage range
650 kHz or 1.3 MHz fixed frequency option
Adjustable output voltage, up to 20 V
Adjustable soft start
Undervoltage lockout
Thermal shutdown
3 mm × 3 mm, 10-lead LFCSP
Supported by ADIsimPower design tool
APPLICATIONS
TFT LCD bias supplies
Portable applications
Industrial/instrumentation equipment
GENERAL DESCRIPTION
The ADP1614 is a step-up, dc-to-dc switching converter with
an integrated power switch capable of providing an output voltage
as high as 20 V. The ADP1614 is available with a pin-adjustable
current limit that is set via an external resistor with the boost
switching frequency fixed to either 650 kHz or 1.3 MHz.
Alternatively, the ADP1614 is also available with fixed 3 A
current limit and a pin-selectable frequency. With a package
height of 0.8 mm, the ADP1614 is optimal for space constrained
applications, such as portable devices or thin film transistor
(TFT) liquid crystal displays (LCDs).
The ADP1614 operates in current-mode pulse-width modulation
(PWM) with up to 94% efficiency. Adjustable soft start prevents
inrush currents when the part is enabled. The PWM current-mode
architecture allows excellent transient response, easy noise filtering,
and the use of small, cost-saving external inductors and capacitors.
Other key features include undervoltage lockout (UVLO), thermal
shutdown (TSD), and logic controlled enable.
The ADP1614 is available in a Pb-free, 10-lead lead frame chip
scale package (LFCSP).
TYPICAL APPLICATIONS CIRCUITS
L1
ADP1614
ADJUSTABLE
VIN CURRENT
8 VIN LIMIT SW 6
ON
OFF
3 EN
CIN
SW 7
FB 2
9 CLRES
RCL CSS
10 SS
COMP 1
GND GND EP
4 5 11
D1 VOUT
R1
R2
RCOMP
CCOMP
COUT
Figure 1. Step-Up Regulator Configuration for Adjustable Current-Limit Options
L1
ADP1614
FIXED
VIN CURRENT
8 VIN LIMIT SW 6
ON SW 7
OFF
3 EN
CIN
1.3MHz
9 FREQ
650kHz
FB 2
(DEFAULT)
10 SS
COMP 1
CSS GND GND EP
4 5 11
D1 VOUT
R1
R2
RCOMP
CCOMP
COUT
Figure 2. Step-Up Regulator Configuration for Fixed Current-Limit Options
Rev. B
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2012–2014 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com

1 Page





ADP1614 pdf, ピン配列
ADP1614
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Typical Applications Circuits .......................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
Thermal Resistance ...................................................................... 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
Theory of Operation ...................................................................... 12
Current-Mode PWM Operation .............................................. 13
Adjustable Current Limit .......................................................... 13
Frequency Selection ................................................................... 13
REVISION HISTORY
11/14—Rev. A to Rev. B
Changes to Ordering Guide .......................................................... 18
6/13—Rev. 0 to Rev. A
Changes to Features Section, General Description Section, and
Figure 1 .............................................................................................. 1
Added Figure 2; Renumbered Sequentially .................................. 1
Changes to Table 1............................................................................ 3
Added FREQ Pin to Table 2 ............................................................ 5
Changes to Pin 9 ............................................................................... 6
Added Figure 26 and Figure 27..................................................... 10
Added Figure 28 to Figure 31........................................................ 11
Changes to Theory of Operation Section and Figure 32........... 12
Changes to Adjustable Current Limit Section and Frequency
Selection Section............................................................................. 13
Changes to Figure 35 and Figure 36 Captions............................ 17
Updated Outline Dimensions ....................................................... 18
Changes to Ordering Guide .......................................................... 18
6/12—Revision 0: Initial Version
Data Sheet
Soft Start ...................................................................................... 13
Thermal Shutdown (TSD) ........................................................ 13
Undervoltage Lockout (UVLO) ............................................... 13
Shutdown Mode ......................................................................... 13
Applications Information .............................................................. 14
ADIsimPower Design Tool ....................................................... 14
Setting the Output Voltage........................................................ 14
Inductor Selection ...................................................................... 14
Choosing the Input and Output Capacitors ........................... 15
Diode Selection........................................................................... 15
Loop Compensation .................................................................. 15
Soft Start Capacitor .................................................................... 16
PCB Layout Guidelines.................................................................. 17
Outline Dimensions ....................................................................... 18
Ordering Guide .......................................................................... 18
Rev. B | Page 2 of 18


3Pages


ADP1614 電子部品, 半導体
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, EN, FB, FREQ to GND
CLRES to GND
COMP to GND
SS to GND
SW to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Rating
−0.3 V to +6 V
−0.3 V to VIN
1.0 V to 1.6 V
−0.3 V to +1.3 V
21 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Absolute maximum ratings apply individually only, not in
combination.
ADP1614
THERMAL RESISTANCE
The junction-to-ambient thermal resistance (θJA) of the package
is specified for the worst-case conditions, that is, a device soldered
in a circuit board for surface-mount packages. The θJA is highly
dependent on the application and board layout. In applications
where high maximum power dissipation exists, attention to
thermal board design is required. The value of θJA may vary,
depending on the printed circuit board (PCB) material, layout,
and environmental conditions.
The boundary conditions for the thermal resistance of the
ADP1614 are modeled under natural convection cooling at
25°C ambient temperature, JESD 51-9, and 1 W power input on a
4-layer board.
Table 3. Thermal Resistance1
Package Type
θJA
10-Lead LFCSP
47
θJC Unit
7.22 °C/W
1 Thermal numbers per JEDEC standard JESD 51-9.
ESD CAUTION
Rev. B | Page 5 of 18

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合計 : 19 ページ
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